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EP2S30F484C3N - Intel

Description: Stratix II Devices

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EP2S30F484C3N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip
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3D Models
EP2S30F484C3N - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA), Option 1—Flip Chip
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EP2S30F484C3N Details

  • Manufacturer Part Number:

    EP2S30F484C3N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    23 X 23 MM, 1 MM PITCH, FBGA-484

  • HTS Code:

    8542.31.00.60

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Clock Frequency-Max:

    717 MHz

  • Combinatorial Delay of a CLB-Max:

    4.45 ns

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    13552

  • Number of Inputs:

    342

  • Number of Logic Cells:

    33880

  • Number of Outputs:

    334

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    13552 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.5 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    CMOS, 90 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    23 mm

EP2S30F484C3N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for EP2S30F484C3N is -40°C to 100°C.
  • To implement a clock tree in EP2S30F484C3N, use the Quartus II software to create a clock network that meets the device's clocking requirements. The software will help you optimize the clock tree for your specific design.
  • The maximum frequency supported by EP2S30F484C3N is 500 MHz.
  • To optimize power consumption in EP2S30F484C3N, use the PowerPlay power analysis tool in Quartus II software to identify areas of high power consumption and optimize your design accordingly. You can also use power-saving features such as clock gating and dynamic voltage and frequency scaling.
  • Yes, EP2S30F484C3N is suitable for high-reliability applications due to its robust design and manufacturing process. However, it's essential to follow Intel's guidelines for designing and testing high-reliability systems.

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EP2S30F484C3N Overview

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Image Part Number Model
Part Image EP2S30F484C3N Altera Corporation

Field Programmable Gate Array, 13552 CLBs, 717MHz, 33880-Cell, CMOS, PBGA484

Part Image EP2S30F484C3 Intel Corporation

Field Programmable Gate Array, 13552 CLBs, 717MHz, 33880-Cell, CMOS, PBGA484