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EP4CE115F29C8N - Intel

Description: ALTERA - EP4CE115F29C8N - FPGA, CYCLONE IV, 115K, 780FBGA

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EP4CE115F29C8N - Intel PCB footprint - BGA - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CE115F29C8N - Intel  - 3D model - BGA - 780-Pin FineLine Ball-Grid Array (FBGA) - Wire Bond - A:2.40
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EP4CE115F29C8N Details

  • Manufacturer Part Number:

    EP4CE115F29C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    29 X 29 MM, 1 MM PITCH, LEAD FREE, FBGA-780

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B780

  • JESD-609 Code:

    e1

  • Length:

    29 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    7155

  • Number of Inputs:

    531

  • Number of Logic Cells:

    114480

  • Number of Outputs:

    531

  • Number of Terminals:

    780

  • Operating Temperature-Max:

    85 °C

  • Organization:

    7155 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA780,28X28,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Width:

    29 mm

EP4CE115F29C8N Frequently Asked Questions (FAQs)

  • The EP4CE115F29C8N has an industrial temperature range of -40°C to 100°C, making it suitable for use in a wide range of environments.
  • To implement a CDC in the EP4CE115F29C8N, you can use the FPGA's built-in clock domain crossing circuits, such as the CDC FIFO or the asynchronous FIFO. You can also use synchronization circuits like double-flop synchronization or gray code synchronization.
  • The maximum frequency achievable with the EP4CE115F29C8N depends on the specific design and the clocking architecture used. However, Intel's Quartus II software can help you estimate the maximum frequency achievable for your design.
  • To optimize power consumption in your EP4CE115F29C8N design, you can use various techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling. You can also use Intel's PowerPlay power analysis and optimization tool to identify areas of high power consumption and optimize your design accordingly.
  • A good reset strategy for the EP4CE115F29C8N involves using a synchronous reset, where the reset signal is synchronized with the clock signal. This helps to prevent metastability issues and ensures that the FPGA is properly reset.

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EP4CE115F29C8N Overview

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Image Part Number Model
Part Image EP4CE115F29C8 Intel Corporation

Field Programmable Gate Array, 7155 CLBs, 472.5MHz, 114480-Cell, PBGA780

Part Image EP4CE115F29C8 Altera Corporation

Field Programmable Gate Array, 7155 CLBs, 472.5MHz, 114480-Cell, PBGA780