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EP4CE40F23C8N - Intel

Description: FPGA - Field Programmable Gate Array FPGA - Cyclone IV E 2475 LABs 328 IOs

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EP4CE40F23C8N - Intel PCB footprint - BGA - BGA - 484-Pin FineLine Ball-Grid Array (FBGA)
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3D Models
EP4CE40F23C8N - Intel  - 3D model - BGA - 484-Pin FineLine Ball-Grid Array (FBGA)
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EP4CE40F23C8N Details

  • Manufacturer Part Number:

    EP4CE40F23C8N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    23 X 23 MM, 1 MM PITCH, LEAD FREE, FBGA-484

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    3A991

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    7

  • Clock Frequency-Max:

    472.5 MHz

  • JESD-30 Code:

    S-PBGA-B484

  • JESD-609 Code:

    e1

  • Length:

    23 mm

  • Moisture Sensitivity Level:

    3

  • Number of CLBs:

    2475

  • Number of Inputs:

    331

  • Number of Logic Cells:

    39600

  • Number of Outputs:

    331

  • Number of Terminals:

    484

  • Operating Temperature-Max:

    85 °C

  • Organization:

    2475 CLBS

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    BGA

  • Package Equivalence Code:

    BGA484,22X22,40

  • Package Shape:

    SQUARE

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FIELD PROGRAMMABLE GATE ARRAY

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    2.4 mm

  • Supply Voltage-Max:

    1.25 V

  • Supply Voltage-Min:

    1.15 V

  • Supply Voltage-Nom:

    1.2 V

  • Surface Mount:

    YES

  • Technology:

    60 nm

  • Temperature Grade:

    OTHER

  • Terminal Finish:

    Tin/Silver/Copper (Sn/Ag/Cu)

  • Terminal Form:

    BALL

  • Terminal Pitch:

    1 mm

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    23 mm

EP4CE40F23C8N Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the EP4CE40F23C8N is -40°C to 100°C.
  • To implement a CDC in the EP4CE40F23C8N, use a synchronizer circuit or a FIFO-based CDC to ensure data integrity across clock domains.
  • The maximum frequency supported by the EP4CE40F23C8N is 500 MHz.
  • To optimize power consumption in the EP4CE40F23C8N, use power-aware design techniques such as clock gating, voltage scaling, and dynamic voltage and frequency scaling.
  • No, the EP4CE40F23C8N is not a radiation-hardened device and is not suitable for use in high-radiation environments.

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EP4CE40F23C8N Overview

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Image Part Number Model
Part Image EP4CE40F23C8 Intel Corporation

Field Programmable Gate Array, 2475 CLBs, 472.5MHz, 39600-Cell, PBGA484

Part Image EP4CE40F23C8 Altera Corporation

Field Programmable Gate Array, 2475 CLBs, 472.5MHz, 39600-Cell, PBGA484