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EPM3256AQC208-7N - Intel

Description: Programmable Logic Device Family

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EPM3256AQC208-7N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 208-Pin Plastic Quad Flat Pack (PQFP)
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EPM3256AQC208-7N - Intel  - 3D model - Quad Flat Packages - 208-Pin Plastic Quad Flat Pack (PQFP)
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EPM3256AQC208-7N Details

  • Manufacturer Part Number:

    EPM3256AQC208-7N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    PLASTIC, QFP-208

  • HTS Code:

    8542.31.00.55

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    0

  • Additional Feature:

    YES

  • Clock Frequency-Max:

    126.6 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G208

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    28 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    154

  • Number of Inputs:

    158

  • Number of Macro Cells:

    256

  • Number of Outputs:

    154

  • Number of Terminals:

    208

  • Operating Temperature-Max:

    70 °C

  • Organization:

    0 DEDICATED INPUTS, 154 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    FQFP

  • Package Equivalence Code:

    QFP208,1.2SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, FINE PITCH

  • Programmable Logic Type:

    EE PLD

  • Propagation Delay:

    7.5 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.1 mm

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Width:

    28 mm

EPM3256AQC208-7N Frequently Asked Questions (FAQs)

  • Intel provides a PCB layout and routing guide for the EPM3256AQC208-7N in the 'Intel Cyclone II FPGA PCB Design Guidelines' document. It's essential to follow these guidelines to ensure signal integrity and minimize electromagnetic interference (EMI).
  • A reliable POR circuit can be implemented using a voltage supervisor IC, such as the MAX809, which monitors the power supply voltage and asserts a reset signal to the FPGA when the voltage is below a certain threshold. The POR circuit should be designed to ensure that the FPGA is properly reset during power-up and power-down sequences.
  • The EPM3256AQC208-7N has a maximum junction temperature of 100°C. To ensure reliable operation, it's essential to provide adequate heat dissipation through the use of heat sinks, thermal interfaces, and airflow management. Intel provides thermal management guidelines in the 'Cyclone II FPGA Thermal Management' document.
  • To ensure EMC compliance, it's essential to follow Intel's guidelines for PCB layout, component selection, and shielding. Additionally, the system should be designed to minimize electromagnetic radiation and susceptibility to external interference. Compliance testing should be performed to ensure the system meets relevant EMC standards.
  • The EPM3256AQC208-7N can be configured and programmed using Intel's Quartus II software. The FPGA can be configured using JTAG, AS, or PS mode. The configuration data can be stored in an external configuration device, such as the EPCS16 or EPCS64, or in a flash memory device.

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EPM3256AQC208-7N Overview

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Part Image EPM3256AQC208-7N Altera Corporation

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Part Image EPM3256AQC208-7 Intel Corporation

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