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EPM570T100I5N - Intel

Description: CPLD - Complex Programmable Logic Devices CPLD - MAX II 440 Macro 76 IOs

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EPM570T100I5N - Intel PCB footprint - Quad Flat Packages - Quad Flat Packages - 100-Pin Plastic Thin Quad Flat Pack (TQFP)
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EPM570T100I5N - Intel  - 3D model - Quad Flat Packages - 100-Pin Plastic Thin Quad Flat Pack (TQFP)
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EPM570T100I5N Details

  • Manufacturer Part Number:

    EPM570T100I5N

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Transferred

  • Package Description:

    TQFP-100

  • Country Of Origin:

    Mainland China, Malaysia, Taiwan, USA, Vietnam

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.01

  • Manufacturer:

    Intel Corporation

  • YTEOL:

    5.4

  • Additional Feature:

    IT CAN ALSO OPERATE AT 3.3V

  • Clock Frequency-Max:

    175.4 MHz

  • In-System Programmable:

    YES

  • JESD-30 Code:

    S-PQFP-G100

  • JESD-609 Code:

    e3

  • JTAG BST:

    YES

  • Length:

    14 mm

  • Moisture Sensitivity Level:

    3

  • Number of I/O Lines:

    76

  • Number of Inputs:

    76

  • Number of Macro Cells:

    440

  • Number of Outputs:

    76

  • Number of Terminals:

    100

  • Operating Temperature-Max:

    100 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    0 DEDICATED INPUTS, 76 I/O

  • Output Function:

    MACROCELL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TFQFP

  • Package Equivalence Code:

    TQFP100,.63SQ

  • Package Shape:

    SQUARE

  • Package Style:

    FLATPACK, THIN PROFILE, FINE PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Programmable Logic Type:

    FLASH PLD

  • Propagation Delay:

    8.7 ns

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    2.625 V

  • Supply Voltage-Min:

    2.375 V

  • Supply Voltage-Nom:

    2.5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    14 mm

EPM570T100I5N Frequently Asked Questions (FAQs)

  • Intel recommends a 4-layer PCB stackup with a signal layer, a power layer, a ground layer, and another signal layer. The datasheet provides guidelines for trace routing, decoupling, and power distribution.
  • A POR circuit can be implemented using a voltage supervisor IC, such as the MAX809, which monitors the power supply voltage and asserts a reset signal to the FPGA during power-up. The datasheet provides guidelines for POR circuit design.
  • The EPM570T100I5N has a maximum junction temperature of 100°C. Thermal management considerations include using a heat sink, thermal interface material, and ensuring good airflow around the device. The datasheet provides thermal resistance values and guidelines for thermal design.
  • Reliable configuration can be ensured by using a robust configuration interface, such as JTAG or passive serial configuration, and following the guidelines in the datasheet for configuration pin connections and signal integrity.
  • EMC considerations include minimizing electromagnetic interference (EMI) through proper PCB layout, using shielding and filtering, and following the guidelines in the datasheet for EMI reduction.

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EPM570T100I5N Overview

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