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FDC8601 - onsemi

Description: High performance trench technology for extremely low rDS(on) ; High power and current handling capability in a widely used surface mount package ; Fast switching speed ; Max rDS(on) = 109 mΩat VGS = 10 V, ID = 2.7 A ; RoHS Compliant ; 100% UIL Tested ; Max rDS(on) = 176 mΩat VGS = 6 V, ID = 2.1 A

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FDC8601 - onsemi PCB footprint - Other - Other - FDC8601-2
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FDC8601 Details

  • Manufacturer Part Number:

    FDC8601

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSOT-23-6

  • Package Description:

    ROHS COMPLIANT, SUPERSOT-6

  • Manufacturer Package Code:

    419BL

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    8 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    6.9

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    2.7 A

  • Drain-source On Resistance-Max:

    0.183 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    5 pF

  • JEDEC-95 Code:

    MO-193AA

  • JESD-30 Code:

    R-PDSO-G6

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    6

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    1.6 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDC8601 Frequently Asked Questions (FAQs)

  • A good PCB layout for the FDC8601 involves keeping the input and output traces separate, using a solid ground plane, and placing the device close to the load. Additionally, using a shielded inductor and keeping the switching node (SW) away from sensitive analog circuits can help minimize EMI.
  • The inductor value for the FDC8601 depends on the input voltage, output voltage, and desired switching frequency. A good starting point is to use the inductor value calculation formula provided in the datasheet, and then adjust based on the specific application requirements.
  • The FDC8601 has an operating temperature range of -40°C to 125°C. High temperatures can affect the device's performance, reducing its efficiency and increasing its power consumption. It's essential to ensure proper thermal management and heat sinking to maintain optimal performance.
  • The FDC8601 has a built-in OCP and SCP feature. To implement it, connect the OCP pin to a resistor divider network that sets the current limit threshold. The device will automatically shut down if the current exceeds this threshold. For SCP, connect the SCP pin to a resistor divider network that sets the short-circuit detection threshold.
  • A low-ESR ceramic capacitor (X5R or X7R) with a value of 4.7 μF to 10 μF is recommended for the input capacitor. The input capacitor helps to filter the input voltage and reduce ripple. A larger capacitor value can help to improve the device's performance, but it may increase the startup time and inrush current.

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FDC8601 Overview

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