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FDPC8014S - onsemi

Description: Q2 N-Channel Max. RDS(on) = 1.2 mΩ at VGS = 10 V, ID = 41 A Max. RDS(on) = 1.4 mΩ at VGS = 4.5 V, ID = 37 A; Low inductance packaging shortens rise/fall times, resulting in lower switching losses ; RoHS Compliant ; Q1 N-Channel Max. RDS(on) = 3.8 mΩ at VGS = 10 V, ID = 20 A Max. RDS(on) = 4.7 mΩ at VGS = 4.5 V, ID = 18 A; MOSFET integration enables optimum layout for lower circuit inductance and reduced switch node ringing

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PCB Footprints
FDPC8014S - onsemi PCB footprint - Other - Other - FDPC8014S-1
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FDPC8014S - onsemi  - 3D model - Other - FDPC8014S-1
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FDPC8014S Details

  • Manufacturer Part Number:

    FDPC8014S

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    PQFN-8

  • Package Description:

    ROHS COMPLIANT, POWER CLIP 56, 8 PIN

  • Manufacturer Package Code:

    483AR

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    4 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    73 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    COMMON DRAIN, 2 ELEMENTS WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    25 V

  • Drain Current-Max (ID):

    20 A

  • Drain-source On Resistance-Max:

    0.0038 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PDSO-N8

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    8

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    42 W

  • Pulsed Drain Current-Max (IDM):

    75 A

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

FDPC8014S Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure proper thermal design, use a heat sink if necessary, and follow the recommended operating conditions. Also, consider using a thermistor or thermal sensor to monitor the device temperature.
  • The maximum allowed voltage on the VIN pin is 28V, but it's recommended to keep it below 24V for reliable operation and to prevent damage to the internal voltage regulator.
  • Yes, the FDPC8014S is AEC-Q100 qualified and suitable for high-reliability and automotive applications. However, ensure that you follow the recommended operating conditions and design guidelines.
  • Check the input voltage, output current, and thermal design. Verify that the device is properly soldered and that there are no signs of physical damage. Use a thermal camera or thermocouple to monitor the device temperature.

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FDPC8014S Overview

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