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FM28V100-TGTR - Infineon

Description: F-RAM 1M (128Kx8) 2.2-3.6V F-RAM

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PCB Footprints
FM28V100-TGTR - Infineon PCB footprint - Small Outline Packages - Small Outline Packages - 32-pin Small TSOP (8 × 13.4 × 1.2 mm)
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3D Models
FM28V100-TGTR - Infineon  - 3D model - Small Outline Packages - 32-pin Small TSOP (8 × 13.4 × 1.2 mm)
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FM28V100-TGTR Details

  • Manufacturer Part Number:

    FM28V100-TGTR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    4.9

  • Access Time-Max:

    105 ns

  • Additional Feature:

    2kv ESD available

  • Data Retention Time-Min:

    10

  • Endurance:

    100000000000000 Write/Erase Cycles

  • JESD-30 Code:

    R-PDSO-G32

  • JESD-609 Code:

    e3

  • Length:

    11.8 mm

  • Memory Density:

    1048576 bit

  • Memory IC Type:

    FRAM

  • Memory Width:

    8

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    32

  • Number of Words:

    131072 words

  • Number of Words Code:

    128000

  • Operating Mode:

    ASYNCHRONOUS

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Organization:

    128KX8

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSOP1

  • Package Equivalence Code:

    TSSOP32,.53,20

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE

  • Parallel/Serial:

    PARALLEL

  • Seated Height-Max:

    1.2 mm

  • Standby Current-Max:

    0.00015 A

  • Standby Voltage-Min:

    2 V

  • Supply Current-Max:

    0.012 mA

  • Supply Voltage-Max (Vsup):

    3.6 V

  • Supply Voltage-Min (Vsup):

    2 V

  • Supply Voltage-Nom (Vsup):

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Terminal Finish:

    Pure Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Width:

    8 mm

FM28V100-TGTR Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the FM28V100-TGTR close to the power source and use short, wide traces for power and ground connections.
  • Use a common mode choke or a ferrite bead to filter out noise and ensure signal integrity. Also, ensure that the bus is properly terminated and that the FM28V100-TGTR is configured correctly for the specific bus protocol.
  • The FM28V100-TGTR has a thermal pad that must be connected to a heat sink or a thermal via to ensure proper heat dissipation. Ensure that the PCB design allows for good airflow and that the device is not exposed to high temperatures.
  • Implement error detection and correction mechanisms in your firmware, such as checksums and retries. Also, use the FM28V100-TGTR's built-in error detection and correction features, such as parity and CRC checks.
  • Use ESD protection devices, such as TVS diodes or ESD arrays, to protect the FM28V100-TGTR from electrostatic discharge. Ensure that the PCB design includes ESD protection for all external interfaces.

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FM28V100-TGTR Overview

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Part Image FM28V100-TG Ramtron International Corporation

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