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FQP13N10 - onsemi

Description: Low Crss ( Typ. 20pF); Low gate charge ( Typ. 12nC); 12.8A, 100V, RDS(on) = 180mΩ(Max.) @VGS = 10 V, ID = 6.4A; 175°C maximum junction temperature rating; 100% avalanche tested

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FQP13N10 - onsemi PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220 MOLDED 3,LEAD+
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FQP13N10 - onsemi  - 3D model - Transistor Outline, Vertical - TO-220 MOLDED 3,LEAD+
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FQP13N10 Details

  • Manufacturer Part Number:

    FQP13N10

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-220-3

  • Package Description:

    TO-220, 3 PIN

  • Manufacturer Package Code:

    340AT

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    2 Days

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    95 mJ

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    100 V

  • Drain Current-Max (ID):

    12.8 A

  • Drain-source On Resistance-Max:

    0.18 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    25 pF

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Packing Method:

    TUBE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    65 W

  • Pulsed Drain Current-Max (IDM):

    51.2 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Max (toff):

    110 ns

  • Turn-on Time-Max (ton):

    140 ns

FQP13N10 Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the FQP13N10 is -55°C to 150°C.
  • To ensure proper biasing, the FQP13N10 requires a minimum gate-source voltage (Vgs) of 4V and a maximum drain-source voltage (Vds) of 100V. Additionally, the gate current (Ig) should be limited to 100mA.
  • For optimal thermal performance, it is recommended to use a PCB with a thermal pad and a heat sink. The device should be mounted on a copper plane with a minimum size of 1 inch x 1 inch. Additionally, a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K should be used.
  • To protect the FQP13N10 from ESD, it is recommended to handle the device in an ESD-controlled environment, use ESD-protective packaging, and ensure that all equipment and tools are properly grounded. Additionally, an ESD protection diode can be used in parallel with the device to protect it from voltage spikes.
  • A gate drive circuit with a resistive divider and a bootstrap capacitor is recommended for the FQP13N10. The resistive divider should be designed to provide a voltage drop of around 5-10V, and the bootstrap capacitor should be around 10-100nF.

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