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FSB560 - onsemi

Description: Transistor, Fairchild, FSB560 Fairchild FSB560 NPN Low Saturation Bipolar Transistor, 2 A, 60 V, 3-Pin SOT-23

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PCB Footprints
FSB560 - onsemi PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - SUPERSOT-23
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3D Models
FSB560 - onsemi  - 3D model - SOT23 (3-Pin) - SUPERSOT-23
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FSB560 Details

  • Manufacturer Part Number:

    FSB560

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOT-23-3

  • Package Description:

    SUPERSOT-3

  • Manufacturer Package Code:

    527AG

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    onsemi

  • YTEOL:

    0

  • Collector Current-Max (IC):

    2 A

  • Collector-Emitter Voltage-Max:

    60 V

  • Configuration:

    SINGLE

  • DC Current Gain-Min (hFE):

    100

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    0.5 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    75 MHz

FSB560 Frequently Asked Questions (FAQs)

  • The FSB560 can operate from -40°C to 150°C, but the recommended operating temperature range is -20°C to 125°C for optimal performance.
  • The FSB560 requires a bias voltage of 5V to 15V, and the recommended bias current is 10mA to 20mA. Ensure the bias voltage is stable and within the recommended range for optimal performance.
  • A multi-layer PCB with a solid ground plane and a thermal pad connected to a heat sink is recommended. Ensure good thermal conductivity and minimal thermal resistance to prevent overheating.
  • Use ESD protection devices such as TVS diodes or ESD protection arrays on the input and output pins. Handle the device by the body or use an anti-static wrist strap to prevent ESD damage.
  • Store the FSB560 in a dry, cool place away from direct sunlight. Handle the device by the body or use an anti-static wrist strap to prevent ESD damage. Avoid bending or flexing the leads.

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FSB560 Overview

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