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FZ2400R17HP4HOSA2 - Infineon

Description: IGBT Module Single Switch 1700 V 2400 A 15500 W Chassis Mount

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FZ2400R17HP4HOSA2 - Infineon  - 3D model
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FZ2400R17HP4HOSA2 Details

  • Manufacturer Part Number:

    FZ2400R17HP4HOSA2

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Hungary

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    14 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    7

  • Case Connection:

    ISOLATED

  • Collector Current-Max (IC):

    2400 A

  • Collector-Emitter Voltage-Max:

    1700 V

  • Configuration:

    COMPLEX

  • JESD-30 Code:

    R-XUFM-X4

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    4

  • Package Body Material:

    UNSPECIFIED

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Polarity/Channel Type:

    N-CHANNEL

  • Surface Mount:

    NO

  • Terminal Form:

    UNSPECIFIED

  • Terminal Position:

    UPPER

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    1810 ns

  • Turn-on Time-Nom (ton):

    1010 ns

FZ2400R17HP4HOSA2 Frequently Asked Questions (FAQs)

  • Infineon provides a dedicated application note (AN2014-01) that outlines the recommended PCB layout and thermal design guidelines for the FZ2400R17HP4HOSA2. It's essential to follow these guidelines to ensure optimal performance, thermal management, and reliability.
  • When selecting a gate driver for the FZ2400R17HP4HOSA2, consider factors such as the driver's output current, voltage rating, and switching frequency. Infineon recommends using their EiceDRIVER™ gate driver ICs, which are specifically designed to work with their IGBT modules. Consult the gate driver datasheet and application notes for more information.
  • Paralleling multiple FZ2400R17HP4HOSA2 modules can increase the overall current rating, but it requires careful consideration of the module's internal layout, thermal management, and gate drive circuitry. Infineon provides guidelines for paralleling IGBT modules in their application notes (e.g., AN2014-01). It's essential to follow these guidelines to ensure reliable operation and avoid potential issues.
  • The FZ2400R17HP4HOSA2 has an internal temperature sensor that can be used for monitoring and protection. Infineon provides information on how to access and interpret the temperature sensor data in their application notes (e.g., AN2014-01). Additionally, the module's datasheet provides information on the temperature sensor's characteristics and recommended usage.
  • To ensure the reliability and longevity of the FZ2400R17HP4HOSA2, it's essential to follow proper storage and handling procedures. Infineon recommends storing the modules in their original packaging, away from direct sunlight, moisture, and extreme temperatures. Handle the modules by the edges, avoiding touching the electrical contacts or sensitive surfaces.

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FZ2400R17HP4HOSA2 Overview

Use the download button to access the FZ2400R17HP4HOSA2 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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