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HCPL-7800 - Avago Technologies

Description: BROADCOM - HCPL-7800 - Isolation Amplifier, Optically, 1 Amplifier, 300 µV, 4.5V to 5.5V, DIP, 8 Pins

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PCB Footprints
HCPL-7800 - Avago Technologies PCB footprint - Dual-In-Line Packages - Dual-In-Line Packages - 8-Pin PDIP
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3D Models
HCPL-7800 - Avago Technologies  - 3D model - Dual-In-Line Packages - 8-Pin PDIP
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HCPL-7800 Details

  • Manufacturer Part Number:

    HCPL-7800

  • Pbfree Code:

    No

  • Rohs Code:

    No

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DIP

  • Package Description:

    DIP, DIP8,.3

  • Pin Count:

    8

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    5

  • Amplifier Type:

    ISOLATION AMPLIFIER

  • Bandwidth (3dB)-Nom:

    100 MHz

  • Common Mode Voltage-Max:

    2.8 V

  • Isolation Voltage-Min:

    3750 V

  • JESD-30 Code:

    R-PDIP-T8

  • JESD-609 Code:

    e0

  • Length:

    9.8 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    DIP

  • Package Equivalence Code:

    DIP8,.3

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    4.7 mm

  • Supply Current-Max:

    16 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    NO

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Pitch:

    2.54 mm

  • Terminal Position:

    DUAL

  • Voltage Gain-Max:

    8.24

  • Voltage Gain-Min:

    7.76

  • Width:

    7.62 mm

HCPL-7800 Frequently Asked Questions (FAQs)

  • A good PCB layout for HCPL-7800 involves keeping the input and output circuits separate, using a ground plane, and minimizing the length of the input and output traces. It's also recommended to use a 4-layer PCB with a dedicated power plane and a dedicated ground plane.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive material for the PCB, and keeping the device within its recommended operating temperature range.
  • Common failure modes of HCPL-7800 include overvoltage, overcurrent, and excessive temperature. To mitigate these, ensure proper voltage regulation, use current-limiting resistors, and implement thermal protection circuits. Additionally, follow proper soldering and handling procedures to prevent damage during assembly.
  • Yes, HCPL-7800 can be used in high-frequency applications, but its bandwidth is limited to around 10 MHz. Above this frequency, the device's performance may degrade. To minimize signal attenuation and distortion, use proper impedance matching and signal termination techniques.
  • To troubleshoot issues with HCPL-7800, start by verifying the input voltage and current, checking for proper PCB layout and component placement, and ensuring that the device is operated within its recommended specifications. Use oscilloscopes and logic analyzers to debug the signal waveforms and identify potential issues.

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HCPL-7800 Overview

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Part Image HCPL-7800-000E Broadcom Limited

Isolation Amplifier, 1 Func, 3750V Isolation-Min, 100MHz Band Width, Hybrid, PDIP8

Part Image HCPL-7800 Broadcom Limited

Isolation Amplifier, 1 Func, 3750V Isolation-Min, 100MHz Band Width, PDIP8

Part Image HCPL-7800-000E Avago Technologies

ISOLATION AMPLIFIER, 3750V ISOLATION-MIN, 100kHz BAND WIDTH, PDIP8, 0.300 INCH, ROHS COMPLIANT, DIP-8

Part Image HCPL-7800 Agilent Technologies Inc

Isolation Amplifier, 1 Func, 3750V Isolation-Min, 100MHz Band Width, Hybrid, PDIP8