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HCPL-788J-000E - Avago Technologies

Description: Broadcom HCPL-788J-000E, Isolation Amplifier, 16-Pin SOIC

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HCPL-788J-000E - Avago Technologies PCB footprint - Small Outline Packages - Small Outline Packages - 16-Lead Surface Mount_2021
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HCPL-788J-000E - Avago Technologies  - 3D model - Small Outline Packages - 16-Lead Surface Mount_2021
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HCPL-788J-000E Details

  • Manufacturer Part Number:

    HCPL-788J-000E

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Package Description:

    SOP, SOP16,.4

  • Pin Count:

    16

  • Reach Compliance Code:

    Compliant

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    8

  • Amplifier Type:

    ISOLATION AMPLIFIER

  • Bandwidth (3dB)-Nom:

    0.03 MHz

  • Isolation Voltage-Min:

    5000 V

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    10.312 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP16,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    3.911 mm

  • Supply Current-Max:

    40 mA

  • Supply Voltage Limit-Max:

    5.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Voltage Gain-Max:

    8.3333

  • Voltage Gain-Min:

    7.5397

  • Width:

    7.5 mm

HCPL-788J-000E Frequently Asked Questions (FAQs)

  • A good PCB layout for the HCPL-788J-000E involves keeping the input and output circuits separate, using a ground plane, and minimizing the length of the input and output traces. It's also recommended to use a shielded cable for the input and output connections.
  • To ensure reliability in high-temperature applications, it's essential to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive material for the PCB, and keeping the device within its recommended operating temperature range.
  • The HCPL-788J-000E has built-in ESD protection, but it's still important to follow proper ESD handling procedures during assembly and installation. This includes using an ESD wrist strap, ESD mat, and ESD-protected packaging.
  • Yes, the HCPL-788J-000E is designed to operate in high-vibration environments. However, it's essential to ensure that the device is properly secured to the PCB and that the PCB is securely attached to the system to prevent mechanical stress.
  • To troubleshoot issues with the HCPL-788J-000E, start by checking the input and output connections, ensuring that they are secure and not damaged. Then, verify that the power supply voltage is within the recommended range. If the issue persists, consult the datasheet and application notes for guidance.

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HCPL-788J-000E Overview

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Part Image HCPL-788J#500 Agilent Technologies Inc

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Part Image HCPL-788J500 Agilent Technologies Inc

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For a full list of alternate parts for HCPL-788J-000E, check out Findchips.com