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HI7190IBZ-T - Renesas Electronics

Description: The Intersil HI7190 is a monolithic instrumentation, sigma delta A/D converter which operates from ±5V supplies. Both the signal and reference inputs are fully differential for maximum flexibility and performance. An internal Programmable Gain Instrumentation Amplifier (PGIA) provides input gains from 1 to 128 eliminating the need for external pre-amplifiers. The on-demand converter autocalibrate function is capable of removing offset and gain errors existing in external and internal circuitry. The on-board

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HI7190IBZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M20.3 (JEDEC MS-013-AC ISSUE C) 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
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HI7190IBZ-T - Renesas Electronics  - 3D model - Small Outline Packages - M20.3 (JEDEC MS-013-AC ISSUE C) 20 LEAD WIDE BODY SMALL OUTLINE PLASTIC PACKAGE
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HI7190IBZ-T Details

  • Manufacturer Part Number:

    HI7190IBZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • Part Package Code:

    SOICW

  • Package Description:

    SOIC-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    M20.3

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    1

  • Analog Input Voltage-Max:

    5 V

  • Analog Input Voltage-Min:

    -2.5 V

  • Converter Type:

    ADC, DELTA-SIGMA

  • JESD-30 Code:

    R-PDSO-G20

  • Length:

    12.8 mm

  • Linearity Error-Max (EL):

    0.0015%

  • Moisture Sensitivity Level:

    3

  • Negative Supply Voltage-Nom:

    -5 V

  • Number of Analog In Channels:

    1

  • Number of Bits:

    24

  • Number of Functions:

    1

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2S COMPLEMENT BINARY

  • Output Format:

    SERIAL

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP20,.4

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    2.65 mm

  • Supply Current-Max:

    1.5 mA

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    7.5 mm

HI7190IBZ-T Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended to ensure optimal thermal performance. The device should be placed near a thermal pad or a heat sink to dissipate heat efficiently.
  • To ensure reliable operation in high-temperature environments, it is essential to follow the recommended thermal design guidelines, use a heat sink or thermal pad, and ensure good airflow around the device. Additionally, consider using a thermal interface material to improve heat transfer.
  • To minimize EMI and RFI, use a shielded enclosure, keep the device away from high-frequency sources, and use a common-mode choke or ferrite bead on the power supply lines. Also, ensure good grounding and decoupling of the device.
  • To troubleshoot ADC issues, check the analog input signal quality, ensure proper ADC configuration, and verify the clock frequency and sampling rate. Also, check for noise and interference on the analog input lines and ensure proper grounding and shielding.
  • The device requires a specific power sequencing to ensure proper operation. The recommended power-up sequence is VCC, then AVCC, and finally DVCC. The power-down sequence should be reversed.

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