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HIN213ECAZ-T - Renesas Electronics

Description: The HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E family of RS-232 transmitters/receivers interface circuits meet all ElA high-speed RS-232E and V. 28 specifications, and are particularly suited for those applications where ±12V is not available. A redesigned transmitter circuit improves data rate and slew rate, which makes this suitable for ISDN and High-Speed modems. The transmitter outputs and receiver inputs are protected to ±15kV ESD (Electrostatic Discharge). They require a single +5V

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HIN213ECAZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M28.209
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HIN213ECAZ-T Details

  • Manufacturer Part Number:

    HIN213ECAZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SSOP

  • Pin Count:

    28

  • Manufacturer Package Code:

    M28.209

  • Country Of Origin:

    Malaysia, Philippines

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-10-26

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    NO

  • Driver Number of Bits:

    4

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; V.28

  • JESD-30 Code:

    R-PDSO-G28

  • JESD-609 Code:

    e3

  • Length:

    10.2 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    4

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    70 °C

  • Out Swing-Min:

    10 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.0016 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    4000 ns

  • Receiver Number of Bits:

    5

  • Seated Height-Max:

    2 mm

  • Supply Current-Max:

    20 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    COMMERCIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    4000 ns

  • Width:

    5.3 mm

HIN213ECAZ-T Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. Ensure a minimum of 1 oz copper thickness and a thermal relief pattern around the device.
  • Implement a robust thermal management system, including a heat sink and thermal interface material. Ensure good airflow and avoid hot spots.
  • Power-up: VCC first, then VDD. Power-down: VDD first, then VCC. Ensure a minimum of 10 ms delay between power-up and power-down sequences.
  • Implement ESD protection diodes (e.g., TVS diodes) on the input pins. Ensure a minimum of 1 kΩ series resistance and a 100 nF capacitor between the diode and the pin.
  • Use 10 μF and 100 nF capacitors in parallel, placed as close as possible to the device. Ensure a minimum of 1 cm distance between the capacitors and the device.

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HIN213ECAZ-T Overview

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