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HIN232EIBNZ-T - Renesas Electronics

Description: The HIN202E, HIN206E, HIN207E, HIN208E, HIN211E, HIN213E, HIN232E family of RS-232 transmitters/receivers interface circuits meet all ElA high-speed RS-232E and V. 28 specifications, and are particularly suited for those applications where ±12V is not available. A redesigned transmitter circuit improves data rate and slew rate, which makes this suitable for ISDN and High-Speed modems. The transmitter outputs and receiver inputs are protected to ±15kV ESD (Electrostatic Discharge). They require a single +5V

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HIN232EIBNZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M6.15
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HIN232EIBNZ-T Details

  • Manufacturer Part Number:

    HIN232EIBNZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOIC-16

  • Pin Count:

    16

  • Manufacturer Package Code:

    M16.15

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-10-26

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    NO

  • Driver Number of Bits:

    2

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; V.28

  • JESD-30 Code:

    R-PDSO-G16

  • JESD-609 Code:

    e3

  • Length:

    9.9 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    16

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    10 V

  • Output Low Current-Max:

    0.0032 A

  • Output Polarity:

    INVERTED

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    10000 ns

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    10 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    10000 ns

  • Width:

    3.9 mm

HIN232EIBNZ-T Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in their application note (R01AN4301EJ0100) which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize EMI.
  • Renesas recommends implementing fault detection mechanisms such as overcurrent protection, overvoltage protection, and thermal monitoring using external components and software-based detection methods. Additionally, the device has built-in protection features such as overcurrent limit and thermal shutdown.
  • The HIN232EIBNZ-T has a maximum junction temperature of 150°C. To ensure reliable operation, it's essential to implement proper thermal management techniques such as heat sinking, thermal interface materials, and airflow management to keep the device within its operating temperature range.
  • Yes, the HIN232EIBNZ-T is designed for high-reliability applications and meets various industry standards such as AEC-Q100 for automotive and IEC 60747-5-5 for industrial applications. However, it's essential to follow Renesas' guidelines for safety-critical applications and perform thorough testing and validation.
  • Renesas provides guidelines for EMC design considerations in their application note (R01AN4301EJ0100). It's essential to follow these guidelines, which include proper PCB layout, component selection, and shielding to minimize EMI and ensure compliance with relevant EMC standards.

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HIN232EIBNZ-T Overview

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