1.60 X 0.80 MM, 0.40 MM HEIGHT, LEAD FREE, PLASTIC PACKAGE-2
Reach Compliance Code:
Compliant
HTS Code:
8541.40.20.00
Manufacturer:
Avago Technologies
YTEOL:
7
Additional Feature:
SUPPORTS INFRARED
Color:
GREEN
Color@Wavelength:
Green
Configuration:
SINGLE
Forward Current-Max:
0.02 A
Forward Voltage-Max:
2.6 V
JESD-609 Code:
e4
Lens Type:
UNTINTED DIFFUSED
Luminous Intensity-Min:
0.0045 cd
Luminous Intensity-Nom:
15.0 mcd
Mounting Feature:
SURFACE MOUNT
Number of Functions:
1
Number of Terminals:
2
Operating Temperature-Max:
85 °C
Operating Temperature-Min:
-40 °C
Optoelectronic Device Type:
SINGLE COLOR LED
Overall Height:
0.4 mm
Packing Method:
TR, 7 INCH
Peak Wavelength:
570 nm
Reverse Voltage-Max:
5 V
Shape:
RECTANGULAR
Size:
1.6 mm
Surface Mount:
YES
Terminal Finish:
Gold (Au) - with Nickel (Ni) barrier
Terminal Pitch:
1.3 mm
Viewing Angle:
130 deg
HSMG-C197 Frequently Asked Questions (FAQs)
Broadcom provides a reference design guide for PCB layout and thermal management, which includes recommendations for component placement, thermal vias, and heat sink design. It's essential to follow these guidelines to ensure optimal performance and reliability.
The HSMG-C197 has multiple power modes, including a low-power mode. To configure for optimal power consumption, refer to the datasheet and application notes for guidance on setting the correct registers and using the power management interface.
The recommended settings for the internal voltage regulators can be found in the datasheet and application notes. It's essential to follow these guidelines to ensure stable operation and prevent damage to the device.
For troubleshooting high-speed interface issues, refer to the datasheet and application notes for guidance on signal integrity, impedance matching, and clock domain crossing. Additionally, use oscilloscopes and signal analyzers to debug signal quality and timing issues.
The HSMG-C197 has a maximum junction temperature of 125°C. To ensure reliable operation, follow the thermal design guidelines in the datasheet and application notes, including heat sink design, thermal interface material selection, and airflow considerations.
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HSMG-C197 Overview
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