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HSMH-C190 - Avago Technologies

Description: 2.6 V Red LED 1608 (0603) SMD, Broadcom HSMH-C190

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HSMH-C190 - Avago Technologies PCB footprint - LEDs Chip - LEDs Chip - HSMH-C190
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HSMH-C190 - Avago Technologies  - 3D model - LEDs Chip - HSMH-C190
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HSMH-C190 Details

  • Manufacturer Part Number:

    HSMH-C190

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    1.60 X 0.80 MM, 0.80 MM HEIGHT, LEAD FREE, PLASTIC PACKAGE-2

  • Reach Compliance Code:

    Compliant

  • HTS Code:

    8541.40.20.00

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    0

  • Additional Feature:

    SUPPORTS INFRARED

  • Color:

    RED

  • Color@Wavelength:

    Red

  • Configuration:

    SINGLE

  • Forward Current-Max:

    0.025 A

  • Forward Voltage-Max:

    2.6 V

  • JESD-609 Code:

    e4

  • Lens Type:

    UNTINTED DIFFUSED

  • Luminous Intensity-Min:

    0.0072 cd

  • Luminous Intensity-Nom:

    17.0 mcd

  • Mounting Feature:

    SURFACE MOUNT

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Optoelectronic Device Type:

    SINGLE COLOR LED

  • Overall Height:

    0.8 mm

  • Packing Method:

    TR, 7 INCH

  • Peak Wavelength:

    660 nm

  • Reverse Voltage-Max:

    5 V

  • Shape:

    RECTANGULAR

  • Size:

    1 mm

  • Surface Mount:

    YES

  • Terminal Finish:

    Gold (Au) - with Nickel (Ni) barrier

  • Terminal Pitch:

    1.3 mm

  • Viewing Angle:

    170 deg

HSMH-C190 Frequently Asked Questions (FAQs)

  • The recommended PCB layout involves placing the HSMH-C190 near the edge of the board to minimize thermal resistance. A thermal pad on the bottom of the package should be connected to a solid ground plane to dissipate heat. A heat sink or thermal interface material can be used to further improve thermal performance.
  • To ensure reliable operation, it's essential to follow the recommended operating conditions, including voltage, current, and temperature ranges. Additionally, consider using thermal protection and overcurrent protection circuits to prevent damage from overheating or excessive current.
  • The HSMH-C190 requires a specific power sequencing and voltage regulation to ensure proper operation. The recommended power-up sequence is VCC, then VDD, and finally VEE. A low-dropout regulator (LDO) or a switching regulator with a low output voltage ripple is recommended for voltage regulation.
  • To minimize EMI and optimize the layout for high-frequency signals, use a multi-layer PCB with a solid ground plane, and keep high-frequency traces short and away from the edge of the board. Use shielding or guard rings around sensitive signals, and consider using a common-mode filter or EMI filter to reduce emissions.
  • Recommended test and measurement procedures include using a high-impedance probe to measure voltage and current, and a spectrum analyzer to measure frequency response and noise floor. Use a calibrated signal generator to test the device's frequency response and a logic analyzer to test digital signals.

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HSMH-C190 Overview

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