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HSMS-281C-BLKG - Avago Technologies

Description: Broadcom HSMS-281C-BLKG, Dual SMT Schottky Diode, Series, 20V 1A, 3-Pin SOT-323

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HSMS-281C-BLKG - Avago Technologies - PCB symbol
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PCB Footprints
HSMS-281C-BLKG - Avago Technologies PCB footprint - Other - Other - HSMS-281C-BLKG-1
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HSMS-281C-BLKG - Avago Technologies - 3D model - Other - HSMS-281C-BLKG-1
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HSMS-281C-BLKG Details

  • Manufacturer Part Number:

    HSMS-281C-BLKG

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SC-70

  • Package Description:

    R-PDSO-G3

  • Pin Count:

    3

  • Reach Compliance Code:

    Compliant

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.10.00.60

  • Manufacturer:

    Avago Technologies

  • YTEOL:

    0

  • Configuration:

    SERIES CONNECTED, CENTER TAP, 2 ELEMENTS

  • Diode Capacitance-Max:

    2 pF

  • Diode Element Material:

    SILICON

  • Diode Type:

    MIXER DIODE

  • Forward Voltage-Max (VF):

    0.41 V

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    2

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Rep Pk Reverse Voltage-Max:

    20 V

  • Surface Mount:

    YES

  • Technology:

    SCHOTTKY

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

HSMS-281C-BLKG Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. The device should be placed near the edge of the board to minimize signal reflections. A 50-ohm microstrip transmission line should be used to connect the device to the antenna.
  • The device requires a single 5V power supply. A 10uF capacitor should be connected between the VCC pin and ground to filter out noise. A 1kohm resistor should be connected between the VCC pin and the enable pin to ensure proper biasing.
  • The device can handle up to 23dBm of input power. Exceeding this limit may cause damage to the device or affect its performance.
  • Use a spectrum analyzer to check the output frequency and power level. Verify that the device is properly biased and that the input signal is within the specified range. Check for any signs of overheating or physical damage to the device.
  • Yes, the device is compatible with lead-free soldering processes. However, the peak reflow temperature should not exceed 260°C to prevent damage to the device.

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HSMS-281C-BLKG Overview

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HSMS-281C-BLKG Alternates

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