IDT71V65803S133BQI - Renesas Electronics

IDT71V65803S133BQI Details

• Manufacturer Part Number:

  IDT71V65803S133BQI

• Part Life Cycle Code:

  Obsolete

• Package Description:

  FBGA-165

• ECCN Code:

  3A991.B.2.A

• HTS Code:

  8542.32.00.41

• Manufacturer:

  Renesas Electronics Corporation

• YTEOL:

  0

• Access Time-Max:

  4.2 ns

• Additional Feature:

  PIPELINED ARCHITECTURE

• I/O Type:

  COMMON

• JESD-30 Code:

  R-PBGA-B165

• JESD-609 Code:

  e0

• Length:

  15 mm

• Memory Density:

  9437184 bit

• Memory IC Type:

  ZBT SRAM

• Memory Width:

  18

• Moisture Sensitivity Level:

  3

• Number of Functions:

  1

• Number of Terminals:

  165

• Number of Words:

  524288 words

• Number of Words Code:

  512000

• Operating Mode:

  SYNCHRONOUS

• Operating Temperature-Max:

  85 °C

• Operating Temperature-Min:

  -40 °C

• Organization:

  512KX18

• Output Characteristics:

  3-STATE

• Package Body Material:

  PLASTIC/EPOXY

• Package Code:

  TBGA

• Package Equivalence Code:

  BGA165,11X15,40

• Package Shape:

  RECTANGULAR

• Package Style:

  GRID ARRAY, THIN PROFILE

• Parallel/Serial:

  PARALLEL

• Peak Reflow Temperature (Cel):

  225

• Qualification Status:

  Not Qualified

• Seated Height-Max:

  1.2 mm

• Standby Current-Max:

  0.06 A

• Standby Voltage-Min:

  3.14 V

• Supply Current-Max:

  0.32 mA

• Supply Voltage-Max (Vsup):

  3.465 V

• Supply Voltage-Min (Vsup):

  3.135 V

• Supply Voltage-Nom (Vsup):

  3.3 V

• Surface Mount:

  YES

• Technology:

  CMOS

• Temperature Grade:

  INDUSTRIAL

• Terminal Finish:

  TIN LEAD

• Terminal Form:

  BALL

• Terminal Pitch:

  1 mm

• Terminal Position:

  BOTTOM

• Time@Peak Reflow Temperature-Max (s):

  30

• Width:

  13 mm