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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IHLP2525CZER100M07
- Part Number IHLP2525CZER100M07
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
IHLP2525CZER100M07 Details
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Manufacturer Part Number:
IHLP2525CZER100M07
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7
IHLP2525CZER100M07 Frequently Asked Questions (FAQs)
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The recommended land pattern for IHLP2525CZER100M07 is a rectangular pad with a size of 2.5 mm x 2.5 mm, with a non-solder mask defined (NSMD) pad shape. The pad should be centered on the component and have a solder mask clearance of 0.1 mm.
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During reflow soldering, it is recommended to use a peak temperature of 260°C for a maximum of 20 seconds. The component should be placed on a flat, even surface to prevent warping or damage. It is also recommended to use a solder paste with a melting point of 217°C to 220°C.
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The maximum current rating for IHLP2525CZER100M07 is 10 A. However, this rating is dependent on the operating temperature and the inductor's core losses. It is recommended to derate the current rating based on the operating temperature and the specific application requirements.
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The inductor's core losses can be calculated using the following formula: P_core = (I^2 * R_dc) + (I^2 * R_ac * f), where P_core is the core loss, I is the current, R_dc is the DC resistance, R_ac is the AC resistance, and f is the frequency. The values for R_dc and R_ac can be found in the datasheet.
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The recommended storage condition for IHLP2525CZER100M07 is in a dry, cool place with a temperature range of -40°C to 40°C and a relative humidity of 60% or less. The components should be stored in their original packaging or in a sealed bag to prevent moisture absorption.
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IHLP2525CZER100M07 Overview
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