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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IHLP2525CZER6R8MA1
- Part Number IHLP2525CZER6R8MA1
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
IHLP2525CZER6R8MA1 Details
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Manufacturer Part Number:
IHLP2525CZER6R8MA1
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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Country Of Origin:
Mainland China
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
10 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7
IHLP2525CZER6R8MA1 Frequently Asked Questions (FAQs)
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The recommended land pattern for the IHLP2525CZER6R8MA1 is a rectangular pad with a size of 2.5 mm x 2.5 mm, with a non-solder mask defined (NSMD) pad shape.
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The IHLP2525CZER6R8MA1 is a moisture-sensitive device. It is recommended to store the components in a dry environment, and to follow the recommended baking and drying procedures before reflow soldering.
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The maximum operating temperature range for the IHLP2525CZER6R8MA1 is -40°C to +125°C, with a maximum storage temperature range of -40°C to +150°C.
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To minimize magnetic field interference, it is recommended to keep the IHLP2525CZER6R8MA1 at least 5 mm away from nearby components, and to use shielding or magnetic shielding materials if necessary.
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The recommended soldering profile for the IHLP2525CZER6R8MA1 is a reflow profile with a peak temperature of 260°C, a dwell time above 217°C of 30-60 seconds, and a cooling rate of 4°C/second.
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IHLP2525CZER6R8MA1 Overview
Use the download button to access the IHLP2525CZER6R8MA1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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