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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IHLP6767GZER150MA1
- Part Number IHLP6767GZER150MA1
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
IHLP6767GZER150MA1 Details
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Manufacturer Part Number:
IHLP6767GZER150MA1
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
8 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7
IHLP6767GZER150MA1 Frequently Asked Questions (FAQs)
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The recommended PCB footprint for IHLP6767GZER150MA1 is a rectangular pad with dimensions of 11.4 mm x 7.4 mm, with a 1.4 mm x 1.4 mm thermal pad in the center. The pad should have a solder mask defined (SMD) and a non-solder mask defined (NSMD) thermal pad.
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To ensure proper thermal management, it is recommended to provide a thermal path from the inductor to a heat sink or a large copper area on the PCB. The thermal pad of the inductor should be connected to the heat sink or copper area using a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K.
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The maximum operating temperature range for IHLP6767GZER150MA1 is -40°C to +125°C. However, the inductor's performance may degrade at higher temperatures, and the maximum current rating may need to be derated accordingly.
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Yes, IHLP6767GZER150MA1 is designed to withstand high-vibration environments. However, it is recommended to follow proper mounting and soldering techniques to ensure the inductor's reliability and performance.
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To select the correct inductor value, you need to consider the operating frequency, current rating, and inductance value required for your application. You can use Vishay's online inductor selection tool or consult with a Vishay application engineer for assistance.
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IHLP6767GZER150MA1 Overview
Use the download button to access the IHLP6767GZER150MA1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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