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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IHLP6767GZER1R8MA1
- Part Number IHLP6767GZER1R8MA1
- Manufacturer Vishay
- Last Modified Date Apr 28, 2022 1:17 PM UTC
- Pinout / Pin List Click Here (Member Only)
IHLP6767GZER1R8MA1 Details
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Manufacturer Part Number:
IHLP6767GZER1R8MA1
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Package Description:
CHIP
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ECCN Code:
EAR99
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HTS Code:
8504.50.80.00
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Factory Lead Time:
8 Weeks
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Manufacturer:
Vishay Intertechnologies
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YTEOL:
7
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Case/Size Code:
6767
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Construction:
Rectangular
IHLP6767GZER1R8MA1 Frequently Asked Questions (FAQs)
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The recommended land pattern for IHLP6767GZER1R8MA1 is available in the Vishay Intertechnologies' Land Pattern Recommendation document, which can be found on their website. The document provides detailed information on the recommended pad size, shape, and spacing for optimal performance and reliability.
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Thermal management is critical for IHLP6767GZER1R8MA1. Ensure good airflow around the component, and consider using a thermal pad or heat sink to dissipate heat. The datasheet provides thermal resistance values, which can be used to estimate the temperature rise. Additionally, follow Vishay's guidelines for thermal management, which can be found in their application notes.
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The maximum operating temperature range for IHLP6767GZER1R8MA1 is -40°C to +125°C. However, it's essential to note that the component's performance and reliability may degrade at higher temperatures. Always check the datasheet and application notes for specific temperature-related information.
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IHLP6767GZER1R8MA1 is designed to withstand moderate vibration levels. However, if your application involves high-vibration environments, it's recommended to consult with Vishay's application engineers to determine the component's suitability. They can provide guidance on the component's vibration tolerance and suggest alternative solutions if necessary.
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To ensure the reliability of IHLP6767GZER1R8MA1, follow Vishay's recommended design guidelines, including proper PCB layout, component placement, and thermal management. Additionally, perform thorough testing and validation of your design to ensure it meets the required specifications and standards.
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IHLP6767GZER1R8MA1 Overview
Use the download button to access the IHLP6767GZER1R8MA1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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