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IHLP6767GZER8R2M01 - Vishay

Description: Vishay IHLP6767GZ-01 Series Shielded Wire-wound SMD Inductor 8.2 μH ±20% 25A Idc

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IHLP6767GZER8R2M01 - Vishay PCB footprint - Inductors Precision Moulded - Inductors Precision Moulded - 17.15x17.150
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IHLP6767GZER8R2M01 - Vishay  - 3D model - Inductors Precision Moulded - 17.15x17.150
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IHLP6767GZER8R2M01 Details

  • Manufacturer Part Number:

    IHLP6767GZER8R2M01

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    CHIP

  • ECCN Code:

    EAR99

  • HTS Code:

    8504.50.80.00

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    7

  • Case/Size Code:

    6767

  • Construction:

    Rectangular

  • Core Material:

    COMPOSITE

  • DC Resistance:

    0.01066 Ω

  • Inductance-Nom (L):

    8.2 µH

  • Inductor Application:

    POWER INDUCTOR

  • Inductor Type:

    GENERAL PURPOSE INDUCTOR

  • JESD-609 Code:

    e3

  • Number of Functions:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Height:

    7 mm

  • Package Length:

    17.15 mm

  • Package Style:

    SMT

  • Package Width:

    17.15 mm

  • Packing Method:

    TR, 13 Inch

  • Rated Current-Max:

    18 A

  • Shape/Size Description:

    RECTANGULAR PACKAGE

  • Shielded:

    YES

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Placement:

    DUAL ENDED

  • Terminal Shape:

    WRAPAROUND

  • Test Frequency:

    0.1 MHz

  • Tolerance:

    20%

IHLP6767GZER8R2M01 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IHLP6767GZER8R2M01 is a rectangular pad with a length of 6.5 mm, a width of 5.5 mm, and a thickness of 0.5 mm. The pad should have a non-solder mask defined (NSMD) pad shape to ensure proper soldering.
  • The thermal derating of the IHLP6767GZER8R2M01 should be handled by following the guidelines provided in the datasheet. The inductor's current rating decreases as the ambient temperature increases. The derating curve is provided in the datasheet, and it should be consulted to determine the maximum current rating at a given temperature.
  • The recommended soldering profile for the IHLP6767GZER8R2M01 is a reflow soldering process with a peak temperature of 260°C (500°F) for a maximum of 20 seconds. The soldering process should be done in a nitrogen atmosphere to prevent oxidation.
  • To ensure the reliability of the IHLP6767GZER8R2M01 in high-vibration applications, it is recommended to use a secure mounting method, such as a screw or adhesive, to prevent the inductor from moving or detaching from the PCB. Additionally, the PCB should be designed to minimize flexure and vibration transmission to the inductor.
  • The equivalent series resistance (ESR) of the IHLP6767GZER8R2M01 is not explicitly stated in the datasheet. However, it can be estimated by using the inductor's DC resistance (Rdc) and the frequency of operation. The ESR can be calculated using the formula: ESR = Rdc + (XL / (2 * pi * f * L)), where XL is the inductive reactance, f is the frequency, and L is the inductance.

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IHLP6767GZER8R2M01 Overview

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Part Image IHLP6767GZEK8R2MA1 Vishay Intertechnologies

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Part Image IHLP6767GZER8R2MA1 Vishay Intertechnologies

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