Part Image

INMP510ACEZ-R7 - TDK

Description: Mic Omni-Directional -38dB Rectangle Solder Pad

Download INMP510ACEZ-R7 Model
Schematic
symbols
Schematic symbol is unavailable for download
PCB
footprints
PCB footprint is unavailable for download
3D
models
3D model is unavailable for download
PCB Footprints
INMP510ACEZ-R7 - TDK PCB footprint - Other - Other - INMP510ACEZ-R7-2
click to zoom
3D Models
INMP510ACEZ-R7 - TDK  - 3D model - Other - INMP510ACEZ-R7-2
click to zoom

INMP510ACEZ-R7 Details

  • Manufacturer Part Number:

    INMP510ACEZ-R7

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    End Of Life

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    TDK Corporation

  • YTEOL:

    0

  • Consumer IC Type:

    CONSUMER CIRCUIT

  • Moisture Sensitivity Level:

    1

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    LGA

  • Package Equivalence Code:

    LGA(UNSPEC)

  • Package Style:

    GRID ARRAY

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Form:

    NO LEAD

  • Terminal Position:

    BOTTOM

  • Time@Peak Reflow Temperature-Max (s):

    30

INMP510ACEZ-R7 Frequently Asked Questions (FAQs)

  • TDK provides a recommended PCB layout in their application notes and design guides. It's essential to follow these guidelines to ensure optimal performance, especially for high-frequency components like the INMP510ACEZ-R7. Key considerations include keeping the component away from noise sources, using a solid ground plane, and minimizing trace lengths and widths.
  • The INMP510ACEZ-R7 has a maximum operating temperature of 125°C. To ensure reliable operation, it's crucial to provide adequate thermal management. This can be achieved through the use of thermal vias, heat sinks, or thermal pads. Additionally, ensure that the component is not exposed to excessive heat sources or high ambient temperatures.
  • TDK recommends following the JEDEC J-STD-020 standard for soldering the INMP510ACEZ-R7. This includes using a peak reflow temperature of 260°C, a soldering time of 10-30 seconds, and a maximum of three reflow cycles. It's also essential to use a solder paste with a melting point above 217°C.
  • To ensure the reliability of the INMP510ACEZ-R7 in high-vibration environments, it's essential to follow TDK's recommended mounting and soldering procedures. Additionally, consider using a vibration-resistant mounting method, such as a screw-down or adhesive-based mounting system. It's also important to ensure that the PCB is designed to withstand the expected vibration levels.
  • The INMP510ACEZ-R7 is a sensitive component that requires proper ESD protection and handling. TDK recommends following the ESD Association's standard for ESD protection, including the use of ESD-safe workstations, wrist straps, and packaging materials. It's also essential to handle the component by the body or frame, rather than the pins, to prevent damage.

Trust Checks

This model has been provided by an expert contributor.
Expert Contribution
This model has been verified by system checks.
System Verified
This model has been reviewed by community users.
Community Approved
Sponsored

INMP510ACEZ-R7 Overview

Use the download button to access the INMP510ACEZ-R7 schematic symbol, PCB footprint, and 3D model.
To find more CAD model downloads similar to this part, try a partial part number search, like INMP5, or try a keyword search, such as Other Consumer ICs

About TDK

TDK-Lambda is a global supplier of power supplies and related products. It is a subsidiary of TDK Corporation, a leading electronics company based in Japan. TDK-Lambda specializes in designing and manufacturing a wide range of AC-DC power supplies, DC-DC converters, programmable power supplies, and EMC/EMI filters for various industries and applications.

Parts related to INMP510ACEZ-R7

Showing 0 results