ALSO OPERATES IN ADJUSTABLE MODE FROM 0.7V TO 18.9V
Analog IC - Other Type:
SWITCHING REGULATOR
Control Mode:
VOLTAGE-MODE
Control Technique:
PULSE WIDTH MODULATION
Input Voltage-Max:
21 V
Input Voltage-Min:
1.5 V
Input Voltage-Nom:
12 V
JESD-30 Code:
R-XQCC-N15
JESD-609 Code:
e3
Length:
5 mm
Moisture Sensitivity Level:
2
Number of Functions:
1
Number of Terminals:
15
Operating Temperature-Max:
125 °C
Operating Temperature-Min:
-40 °C
Output Current-Max:
6 A
Output Voltage-Max:
10.8 V
Output Voltage-Min:
0.7 V
Package Body Material:
UNSPECIFIED
Package Code:
HVQCCN
Package Equivalence Code:
LCC17(UNSPEC)
Package Shape:
RECTANGULAR
Package Style:
CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE
Peak Reflow Temperature (Cel):
260
Qualification Status:
Not Qualified
Seated Height-Max:
1 mm
Supply Current-Max (Isup):
0.5 mA
Surface Mount:
YES
Switcher Configuration:
BUCK
Switching Frequency-Max:
1650 kHz
Temperature Grade:
AUTOMOTIVE
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
NO LEAD
Terminal Pitch:
0.5 mm
Terminal Position:
QUAD
Time@Peak Reflow Temperature-Max (s):
30
Width:
4 mm
IR3856MTRPBF Frequently Asked Questions (FAQs)
A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a heat sink or a thermal pad to dissipate heat efficiently.
Ensure proper heat sinking, use a thermal interface material (TIM) with a thermal conductivity of at least 1 W/m-K, and follow the recommended PCB layout guidelines. Also, consider using a thermocouple or thermistor to monitor the device temperature.
Critical components include the input capacitors, output inductors, and output capacitors. Ensure that these components are selected based on the specific application requirements and follow the recommended component values and layout guidelines.
Use an oscilloscope to monitor the output voltage, input voltage, and current waveforms. Check for proper PCB layout, component selection, and soldering quality. Consult the datasheet and application notes for troubleshooting guidelines and simulation models.
Use a shielded enclosure, ensure proper PCB layout and component placement, and follow the recommended filtering and shielding guidelines. Consider using a common-mode choke and EMI filters to reduce electromagnetic interference.
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System Verified
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IR3856MTRPBF Overview
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