AVALANCHE RATED, HIGH RELIABILITY, ULTRA LOW RESISTANCE
Avalanche Energy Rating (Eas):
140 mJ
Configuration:
SEPARATE, 2 ELEMENTS WITH BUILT-IN DIODE
DS Breakdown Voltage-Min:
55 V
Drain Current-Max (ID):
5.1 A
Drain-source On Resistance-Max:
0.05 Ω
FET Technology:
METAL-OXIDE SEMICONDUCTOR
JEDEC-95 Code:
MS-012AA
JESD-30 Code:
R-PDSO-G8
JESD-609 Code:
e3
Moisture Sensitivity Level:
1
Number of Elements:
2
Number of Terminals:
8
Operating Mode:
ENHANCEMENT MODE
Operating Temperature-Max:
150 °C
Package Body Material:
PLASTIC/EPOXY
Package Shape:
RECTANGULAR
Package Style:
SMALL OUTLINE
Peak Reflow Temperature (Cel):
260
Polarity/Channel Type:
N-CHANNEL
Power Dissipation-Max (Abs):
2 W
Pulsed Drain Current-Max (IDM):
42 A
Qualification Status:
Not Qualified
Surface Mount:
YES
Terminal Finish:
Matte Tin (Sn)
Terminal Form:
GULL WING
Terminal Position:
DUAL
Time@Peak Reflow Temperature-Max (s):
30
Transistor Application:
SWITCHING
Transistor Element Material:
SILICON
IRF7341TRPBF Frequently Asked Questions (FAQs)
The maximum operating temperature range for the IRF7341TRPBF is -55°C to 175°C.
To ensure reliability, follow proper thermal management, use a suitable heat sink, and ensure the device is operated within its specified voltage and current ratings.
The recommended gate drive voltage for the IRF7341TRPBF is between 10V and 15V, with a maximum gate-source voltage of ±20V.
Yes, the IRF7341TRPBF is suitable for high-frequency switching applications, but ensure the device is operated within its specified frequency range and follow proper PCB design guidelines to minimize parasitic inductance and capacitance.
Handle the device with proper ESD precautions, such as using an ESD wrist strap or mat, and ensure the device is stored in an ESD-protected environment.
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Community Provided
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System Verified
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Community Approved
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IRF7341TRPBF Overview
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