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IRFP32N50KPBF - Vishay

Description: MOSFET, N, 500V, 32A, TO-247AC

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IRFP32N50KPBF Details

  • Manufacturer Part Number:

    IRFP32N50KPBF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    TO-247AC

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    0

  • Avalanche Energy Rating (Eas):

    450 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    32 A

  • Drain-source On Resistance-Max:

    0.16 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-247AC

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    460 W

  • Pulsed Drain Current-Max (IDM):

    130 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRFP32N50KPBF Frequently Asked Questions (FAQs)

  • The SOA for the IRFP32N50KPBF is not explicitly stated in the datasheet, but it can be estimated based on the device's thermal resistance and maximum junction temperature. As a general rule, it's recommended to operate the device within the boundaries of the SOA curve provided in the datasheet to ensure reliable operation.
  • To ensure the IRFP32N50KPBF is fully turned on, the gate-source voltage (Vgs) should be at least 10V, and the gate current should be sufficient to charge the gate capacitance quickly. A gate driver or a dedicated gate drive circuit can be used to provide a high current pulse to the gate.
  • The maximum allowed Vds during switching is not explicitly stated in the datasheet, but it's generally recommended to limit the Vds to 50-60% of the maximum rated voltage (50V) to ensure reliable operation and minimize the risk of avalanche breakdown.
  • Thermal management is critical for the IRFP32N50KPBF. Ensure good thermal contact between the device and a heat sink, and consider using a thermal interface material to minimize thermal resistance. The maximum junction temperature (Tj) should not exceed 175°C, and the device should be operated within the recommended thermal boundaries to prevent overheating.
  • A good PCB layout for the IRFP32N50KPBF should minimize the parasitic inductance and capacitance. Use a compact layout, keep the gate and source pins close together, and use a ground plane to reduce electromagnetic interference (EMI). Avoid running high-current traces near the MOSFET to minimize electromagnetic interference (EMI).

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IRFP32N50KPBF Overview

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