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IRFS11N50APBF - Vishay

Description: IRFS11N50APBF, N-channel MOSFET Transistor 11 A 500 V, 3-Pin D2PAK

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IRFS11N50APBF Details

  • Manufacturer Part Number:

    IRFS11N50APBF

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Package Description:

    LEAD FREE, D2PAK-3

  • Pin Count:

    3

  • ECCN Code:

    EAR99

  • Manufacturer:

    Vishay Intertechnologies

  • YTEOL:

    6.25

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    275 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    11 A

  • Drain-source On Resistance-Max:

    0.52 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    170 W

  • Pulsed Drain Current-Max (IDM):

    44 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRFS11N50APBF Frequently Asked Questions (FAQs)

  • The maximum SOA for the IRFS11N50APBF is typically defined by the manufacturer as the maximum voltage and current ratings, which are 500V and 11A respectively. However, it's essential to consult the datasheet and application notes for specific guidance on SOA.
  • To minimize switching losses, ensure the gate drive voltage is sufficient (typically 10-15V) and the gate resistance is low (typically <10 ohms). Also, consider using a gate driver IC or a dedicated MOSFET driver to provide a high-current, fast-rise-time signal to the gate.
  • The thermal resistance (RθJA) of the IRFS11N50APBF is approximately 62°C/W. This means that for every watt of power dissipated, the junction temperature will rise by 62°C. Proper thermal design, including heat sinking and airflow, is crucial to ensure the MOSFET operates within its safe operating area.
  • The IRFS11N50APBF has a relatively high switching frequency capability, but it's essential to consider the MOSFET's switching characteristics, such as the rise and fall times, and ensure the design meets the required frequency and power requirements.
  • Implement overvoltage protection (OVP) and overcurrent protection (OCP) circuits to prevent damage to the MOSFET. This can include using voltage regulators, zener diodes, and current-sensing resistors to detect and respond to fault conditions.

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IRFS11N50APBF Overview

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