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IRFU9024NPBF - Infineon

Description: MOSFET P-Channel 55V 11A IPAK Infineon IRFU9024NPBF P-channel MOSFET Transistor, 11 A, 55 V, 3-Pin IPAK

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PCB Footprints
IRFU9024NPBF - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - IPAK (TO-251AA)
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3D Models
IRFU9024NPBF - Infineon  - 3D model - Transistor Outline, Vertical - IPAK (TO-251AA)
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IRFU9024NPBF Details

  • Manufacturer Part Number:

    IRFU9024NPBF

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    5.1

  • Additional Feature:

    AVALANCHE RATED, HIGH RELIABILITY

  • Avalanche Energy Rating (Eas):

    62 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    55 V

  • Drain Current-Max (ID):

    11 A

  • Drain-source On Resistance-Max:

    0.175 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-251AA

  • JESD-30 Code:

    R-PSIP-T3

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    IN-LINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    38 W

  • Pulsed Drain Current-Max (IDM):

    44 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn) - with Nickel (Ni) barrier

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRFU9024NPBF Frequently Asked Questions (FAQs)

  • The maximum operating temperature range for the IRFU9024NPBF is -40°C to 150°C.
  • A recommended PCB layout for optimal thermal performance includes a thermal pad connected to a large copper area on the PCB, and a minimum of 2 oz copper thickness.
  • To ensure reliable operation in high-humidity environments, it is recommended to apply a conformal coating to the device, and to follow proper PCB design and assembly guidelines to prevent moisture ingress.
  • The recommended soldering conditions for the IRFU9024NPBF are a peak temperature of 260°C, with a dwell time of 10-30 seconds, and a soldering iron temperature of 350°C.
  • To prevent EOS damage, it is recommended to use a transient voltage suppressor (TVS) or a voltage clamp to limit voltage spikes, and to follow proper PCB design and layout guidelines to minimize parasitic inductance and capacitance.

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IRFU9024NPBF Overview

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