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IRFZ44E - Infineon

Description: N-channel MOSFET,IRFZ44E 48A 60V

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IRFZ44E - Infineon PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-220AB 3pin
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IRFZ44E - Infineon  - 3D model - Transistor Outline, Vertical - TO-220AB 3pin
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IRFZ44E Details

  • Manufacturer Part Number:

    IRFZ44E

  • Part Life Cycle Code:

    Obsolete

  • Package Description:

    TO-220AB, 3 PIN

  • ECCN Code:

    EAR99

  • HTS Code:

    8541.29.00.95

  • Manufacturer:

    Infineon Technologies AG

  • YTEOL:

    0

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    220 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    60 V

  • Drain Current-Max (ID):

    48 A

  • Drain-source On Resistance-Max:

    0.023 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • JEDEC-95 Code:

    TO-220AB

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e0

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    175 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Polarity/Channel Type:

    N-CHANNEL

  • Pulsed Drain Current-Max (IDM):

    192 A

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    NO

  • Terminal Finish:

    Tin/Lead (Sn/Pb)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

IRFZ44E Frequently Asked Questions (FAQs)

  • The maximum safe operating area (SOA) of the IRFZ44E is not explicitly stated in the datasheet, but it can be determined by consulting the SOA curves provided in the application note AN-936. The SOA curves provide a graphical representation of the maximum drain-source voltage and drain current that the device can handle without damage.
  • The junction-to-case thermal resistance (RθJC) of the IRFZ44E is not directly provided in the datasheet. However, it can be calculated using the thermal resistance values provided in the datasheet. RθJC can be calculated as RθJC = RθJL - RθLS, where RθJL is the junction-to-lead thermal resistance and RθLS is the lead-to-case thermal resistance.
  • The recommended gate drive voltage for the IRFZ44E is not explicitly stated in the datasheet. However, a general rule of thumb is to use a gate drive voltage that is at least 10V to ensure proper turn-on and minimize switching losses. A higher gate drive voltage can also help to reduce the turn-on time and improve the overall performance of the device.
  • The IRFZ44E is a power MOSFET designed for high-power switching applications, but it may not be suitable for very high-frequency switching applications (>100 kHz). The device has a relatively high gate charge and output capacitance, which can lead to increased switching losses and reduced efficiency at high frequencies. However, it can be used in high-frequency applications with proper design and layout considerations, such as minimizing the gate drive impedance and using a suitable gate driver IC.
  • The body diode of the IRFZ44E is a parasitic diode that can conduct current during the switching transition. To handle the body diode, it is recommended to use a fast-recovery diode (FRD) or a Schottky diode in parallel with the MOSFET to reduce the reverse recovery time and minimize the switching losses. Additionally, the gate drive circuit should be designed to minimize the turn-off time and reduce the diode conduction time.

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