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ISL28433FBZ - Renesas Electronics

Description: The ISL28433 is a quad micropower, chopper stabilized operational amplifier that is optimized for single and dual supply operation from 1.65V to 6.0V and ±0.825V to ±3.0V. Their low supply current of 18µA and wide input range enable the ISL28433 to be an excellent general purpose op amp for a wide range of applications. The ISL28433 is ideal for handheld devices that operate off 2 AA or single Li-ion batteries. The ISL28433 is available in 14 Ld TSSOP, 14 Ld SOIC and 14 Ld 3mm x 4mm TDFN packages. The devic

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ISL28433FBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - MDP0027-
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ISL28433FBZ - Renesas Electronics  - 3D model - Small Outline Packages - MDP0027-
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ISL28433FBZ Details

  • Manufacturer Part Number:

    ISL28433FBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOICN-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    MDP0027

  • Country Of Origin:

    Malaysia, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    5

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    CHOPPER-STAB

  • Average Bias Current-Max (IIB):

    0.0006 µA

  • Bias Current-Max (IIB) @25C:

    0.18 µA

  • Common-mode Reject Ratio-Min:

    115 dB

  • Common-mode Reject Ratio-Nom:

    125 dB

  • Frequency Compensation:

    NO

  • Input Offset Voltage-Max:

    11 µV

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.6614 mm

  • Low-Bias:

    NO

  • Low-Offset:

    YES

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    4

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    TUBE

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.7272 mm

  • Slew Rate-Nom:

    0.2 V/us

  • Supply Current-Max:

    0.14 mA

  • Supply Voltage Limit-Max:

    6.5 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    400

  • Wideband:

    NO

  • Width:

    3.9116 mm

ISL28433FBZ Frequently Asked Questions (FAQs)

  • Renesas provides a recommended PCB layout guide in the application note AN1995, which includes guidelines for component placement, routing, and thermal management to ensure optimal performance and minimize noise.
  • The selection of input and output capacitors depends on the specific application and frequency range. Renesas recommends using low-ESR capacitors with a value of 10uF to 22uF for input and output decoupling. The application note AN1995 provides more detailed guidance on capacitor selection.
  • The maximum power dissipation of the ISL28433FBZ is dependent on the ambient temperature and the thermal resistance of the package. According to the datasheet, the maximum power dissipation is 1.4W at 25°C ambient temperature. However, it's recommended to consult the thermal derating curve in the datasheet to determine the maximum power dissipation for a specific application.
  • The ISL28433FBZ is rated for operation up to 125°C junction temperature. However, the device's performance and reliability may degrade at high temperatures. Renesas recommends consulting the datasheet and application notes for guidance on using the device in high-temperature environments.
  • To ensure EMC, Renesas recommends following proper PCB layout and design practices, such as using a solid ground plane, minimizing trace lengths, and using shielding and filtering components as necessary. Additionally, the application note AN1995 provides guidance on EMC considerations for the ISL28433FBZ.

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