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ISL3158EIUZ - Renesas Electronics

Description: The ISL315xE family of 5V powered RS-485/RS-422 transceivers features high output drive and high ESD protection. The devices withstand ±16. 5kV IEC61000-4- 2 ESD strikes without latch-up. The large output voltage of 3. 1V typical into a 54Ω load provides high noise immunity, and enables the drive of up to 8000ft long bus segments, or eight 120Ω terminations in a star topology. These devices possess less than 125μA bus input currents, thus constituting a true 1/8 unit load. The high output drive combined wit

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ISL3158EIUZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.118
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ISL3158EIUZ - Renesas Electronics  - 3D model - Small Outline Packages - M8.118
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ISL3158EIUZ Details

  • Manufacturer Part Number:

    ISL3158EIUZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.118

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00002 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    2.4 V

  • Output Characteristics:

    3-STATE

  • Output Low Current-Max:

    0.008 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    45 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.8 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    30 ns

  • Width:

    3 mm

ISL3158EIUZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use short, direct traces for the RS-485 bus and keep them away from noise sources.
  • Use shielded cables, twisted pairs, and a common-mode choke to reduce electromagnetic interference (EMI). Implement error-checking mechanisms, such as CRC or checksum, to detect data corruption. Consider using a repeater or isolator to extend the transmission distance.
  • The maximum cable length depends on the baud rate, cable quality, and noise environment. As a general guideline, the ISL3158EIUZ can support up to 4000 feet (1219 meters) at 9600 bps, but this may vary depending on the specific application.
  • Implement a collision detection mechanism, such as a non-return-to-zero (NRZ) encoding scheme, to detect and resolve bus contention. Use a protocol like token passing or CSMA/CD to manage node access to the bus.
  • The device has a junction-to-ambient thermal resistance of 45°C/W. Ensure good airflow, use a heat sink if necessary, and avoid blocking the airflow around the device. Keep the device away from heat sources and use thermal interface materials to reduce thermal resistance.

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