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ISL32490EIUZ-T - Renesas Electronics

Description: The ISL32490E, ISL32492E, ISL32493E, ISL32495E, ISL32496E, and ISL32498E are fault protected, 5V powered, differential transceivers that exceed the RS-485 and RS-422 standards for balanced communication. The RS-485 transceiver pins (driver outputs and receiver inputs) are fault protected up to ±60V and are protected against ±16. 5kV ESD strikes without latch-up. Additionally, the extended Common-Mode Range (CMR) allows these transceivers to operate in environments with common-mode voltages up to ±25V (>2x t

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ISL32490EIUZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M10.118
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ISL32490EIUZ-T - Renesas Electronics  - 3D model - Small Outline Packages - M10.118
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ISL32490EIUZ-T Details

  • Manufacturer Part Number:

    ISL32490EIUZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-10

  • Pin Count:

    10

  • Manufacturer Package Code:

    M10.118

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    0

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    S-PDSO-G10

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    10

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    280 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.1 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    1000 ns

  • Width:

    3 mm

ISL32490EIUZ-T Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL32490EIUZ-T involves keeping the analog and digital grounds separate, using a solid ground plane, and placing the device close to the power supply. Additionally, it's recommended to use a low-ESR capacitor for the VCC pin and to minimize the length of the traces connected to the high-frequency pins.
  • To ensure reliable operation in high-temperature environments, it's essential to follow proper thermal management practices. This includes providing adequate heat sinking, using a thermally conductive PCB material, and keeping the device within its specified operating temperature range. Additionally, consider using thermal interface materials and heat sinks to reduce the junction temperature.
  • Operating the ISL32490EIUZ-T at a lower supply voltage than the recommended 3.3V may result in reduced performance, increased power consumption, and potential reliability issues. Conversely, operating at a higher supply voltage may lead to increased power consumption, heat generation, and potentially reduced lifespan. It's recommended to operate the device within the specified supply voltage range for optimal performance and reliability.
  • To troubleshoot issues related to the internal oscillator, start by verifying the oscillator frequency using an oscilloscope or frequency counter. Check the XTAL1 and XTAL2 pins for proper termination and ensure that the crystal oscillator is properly connected. Also, verify that the oscillator is enabled by checking the OSCEN bit in the device's control register.
  • In noisy or EMI-prone environments, it's essential to take measures to minimize the impact of electromagnetic interference on the device. This includes using shielding, filtering, and grounding techniques to reduce noise coupling. Additionally, consider using a Faraday cage or EMI shielding around the device and its associated components.

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ISL32490EIUZ-T Overview

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