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ISL32603EFUZ-T - Renesas Electronics

Description: The ISL32600E, ISL32601E, ISL32602E, and ISL32603E are ±15kV IEC61000 ESD protected, micro-power, wide supply range transceivers for differential communication. The ISL32600E and ISL32601E operate with VCC ≥ 2. 7V and have maximum supply currents as low as 100µA with both the transmitter (Tx) and receiver (Rx) enabled. The ISL32602E and ISL32603E operate with supply voltages as low as 1. 8V. These transceivers have very low bus currents, so they present less than a 1/8 unit load to the bus. This allows more

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ISL32603EFUZ-T - Renesas Electronics - PCB symbol
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ISL32603EFUZ-T - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M8.118
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ISL32603EFUZ-T - Renesas Electronics - 3D model - Small Outline Packages - M8.118
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ISL32603EFUZ-T Details

  • Manufacturer Part Number:

    ISL32603EFUZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    MSOP

  • Package Description:

    MSOP-8

  • Pin Count:

    8

  • Manufacturer Package Code:

    M8.118

  • Country Of Origin:

    Malaysia, Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.000001 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-485; EIA-422

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Moisture Sensitivity Level:

    2

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    0.8 V

  • Output Characteristics:

    3-STATE

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    1000 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.1 mm

  • Supply Current-Max:

    0.35 mA

  • Supply Voltage-Max:

    3.6 V

  • Supply Voltage-Min:

    1.8 V

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2600 ns

  • Width:

    3 mm

ISL32603EFUZ-T Frequently Asked Questions (FAQs)

  • A good PCB layout for the ISL32603EFUZ-T involves keeping the analog and digital grounds separate, using a solid ground plane, and minimizing the length of the signal traces. It's also recommended to place the device close to the signal sources and to use a low-ESR capacitor for the VCC pin.
  • The ISL32603EFUZ-T requires a single 3.3V power supply, and it's recommended to use a low-dropout linear regulator or a switching regulator with a low noise output. The power sequencing requirement is to power up the VCC pin before the SCL and SDA pins.
  • The ISL32603EFUZ-T supports cable lengths up to 1.5 meters, and it's recommended to use a shielded twisted-pair cable with a characteristic impedance of 100 ohms. The cable should also be terminated with a 100-ohm resistor at the receiving end.
  • To troubleshoot issues with the ISL32603EFUZ-T, check the power supply voltage, signal integrity, and cable connections. Use an oscilloscope to verify the signal waveforms and check for noise or distortion. Also, ensure that the device is properly configured and that the I2C bus is not overloaded.
  • The ISL32603EFUZ-T is designed to meet the EMI/EMC requirements of various regulatory bodies, but it's still important to follow good design practices, such as using a shielded enclosure, minimizing loop areas, and using EMI filters or chokes as needed. Ensure that the device is properly grounded and that the PCB layout is optimized for EMI/EMC performance.

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ISL32603EFUZ-T Overview

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