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ISL4489EIBZ - Renesas Electronics

Description: The ISL4489E and ISL4491E are ESD protected, “fractional”Unit Load (UL), BiCMOS, 5V powered, single transceivers that meet both the RS-485 and RS-422 standards for balanced communication. Each driver output and receiver input is protected against ±15kV ESD strikes without latch-up. Unlike competitive versions, these devices are specified for 10% tolerance supplies (4. 5V to 5. 5V). The Rx inputs and Tx outputs present a 1/8 unit load to the RS-485 bus, which allows a total of 256 transmitters and receivers

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ISL4489EIBZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M14.15 Rev 1, 10/09
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ISL4489EIBZ - Renesas Electronics  - 3D model - Small Outline Packages - M14.15 Rev 1, 10/09
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ISL4489EIBZ Details

  • Manufacturer Part Number:

    ISL4489EIBZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOICN

  • Package Description:

    SOP-14

  • Pin Count:

    14

  • Manufacturer Package Code:

    M14.15

  • Country Of Origin:

    Malaysia, Philippines, Taiwan

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    YES

  • Driver Number of Bits:

    1

  • High Level Input Current-Max:

    0.00013 A

  • Input Characteristics:

    DIFFERENTIAL SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-422; EIA-485

  • JESD-30 Code:

    R-PDSO-G14

  • JESD-609 Code:

    e3

  • Length:

    8.65 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    1

  • Number of Terminals:

    14

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Out Swing-Min:

    2 V

  • Output Low Current-Max:

    -0.004 A

  • Output Polarity:

    COMPLEMENTARY

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP14,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Receive Delay-Max:

    2000 ns

  • Receiver Number of Bits:

    1

  • Seated Height-Max:

    1.75 mm

  • Supply Current-Max:

    0.46 mA

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    5 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    4.5 V

  • Supply Voltage1-Nom:

    5 V

  • Surface Mount:

    YES

  • Technology:

    BICMOS

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transmit Delay-Max:

    2000 ns

  • Width:

    3.9 mm

ISL4489EIBZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use short, wide traces for the high-frequency signals and keep the sensitive analog signals away from the digital signals.
  • Use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) for power decoupling, placed as close to the device as possible. Ensure the power supply is clean and regulated, with minimal noise and ripple. Use a separate power plane for the analog and digital supplies.
  • Use a 100-ohm differential termination resistor at the receiving end of the transmission line, and a 50-ohm series resistor at the transmitting end. This ensures proper signal integrity and minimizes reflections.
  • Consult the application note and evaluation board documentation for guidance on optimizing the device for specific applications, such as adjusting the output common-mode voltage, selecting the optimal output impedance, and configuring the device for specific data rates and protocols.
  • Ensure good airflow around the device, and consider using a heat sink or thermal pad if the device is expected to operate at high temperatures or with high power dissipation. Monitor the device's junction temperature and adjust the thermal design accordingly.

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