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ISL60002DIH326Z-TK - Renesas Electronics

Description: The ISL60002 FGA voltage references are very high precision analog voltage references fabricated using the Renesas proprietary Floating Gate Analog (FGA) technology and feature low supply voltage operation at ultra-low 350nA operating current. Additionally, the ISL60002 family features guaranteed initial accuracy as low as ±1. 0mV and 20ppm/°C temperature coefficient. The initial accuracy and temperature stability performance of the ISL60002 family, plus the low supply voltage and 350nA power consumption, e

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ISL60002DIH326Z-TK - Renesas Electronics PCB footprint - SOT23 (3-Pin) - SOT23 (3-Pin) - P3.064A
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ISL60002DIH326Z-TK - Renesas Electronics  - 3D model - SOT23 (3-Pin) - P3.064A
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ISL60002DIH326Z-TK Details

  • Manufacturer Part Number:

    ISL60002DIH326Z-TK

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOT23

  • Pin Count:

    3

  • Manufacturer Package Code:

    P3.064A

  • Country Of Origin:

    Thailand

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    6

  • Analog IC - Other Type:

    THREE TERMINAL VOLTAGE REFERENCE

  • JESD-30 Code:

    R-PDSO-G3

  • JESD-609 Code:

    e3

  • Length:

    2.92 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Outputs:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Voltage-Max:

    7.6 V

  • Output Voltage-Min:

    -2.4 V

  • Output Voltage-Nom:

    2.6 V

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    1.12 mm

  • Supply Voltage-Max (Vsup):

    5.5 V

  • Supply Voltage-Min (Vsup):

    2.8 V

  • Supply Voltage-Nom (Vsup):

    3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temp Coef of Voltage-Max:

    20 ppm/°C

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.95 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Trim/Adjustable Output:

    NO

  • Width:

    1.3 mm

ISL60002DIH326Z-TK Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or heat sink, using thermal vias to dissipate heat, and keeping the surrounding area clear of other components.
  • To ensure reliable operation across the full temperature range, follow the recommended operating conditions, use a suitable thermal design, and consider the device's thermal derating characteristics.
  • Key considerations for EMI and RFI mitigation include using a shielded enclosure, minimizing loop areas, using bypass capacitors, and following good PCB layout practices.
  • Select input and output capacitors based on the device's recommended capacitance values, voltage ratings, and ESR characteristics, and consider the application's specific requirements.
  • The device's quiescent current can significantly impact battery life, so it's essential to consider this when designing battery-powered systems and to optimize the system's power management strategy accordingly.

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ISL60002DIH326Z-TK Overview

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