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ISL83386EIVZ - Renesas Electronics

Description: The ISL83386E contains 3. 0V to 5. 5V powered RS-232 transmitters/receivers that meet ElA/TIA-232 and V. 28/V. 24 specifications, even at VCC = 3. 0V. Targeted applications are PDAs, Palmtops, and cell phones in which the low operational power consumption, and even lower standby power consumption is critical. Efficient on-chip charge-pumps, coupled with a manual power-down function reduces the standby supply current to a 1µA trickle. Small footprint packaging and the use of small, low value capacitors ensur

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ISL83386EIVZ - Renesas Electronics PCB footprint - Small Outline Packages - Small Outline Packages - M20.173
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ISL83386EIVZ - Renesas Electronics  - 3D model - Small Outline Packages - M20.173
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ISL83386EIVZ Details

  • Manufacturer Part Number:

    ISL83386EIVZ

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TSSOP

  • Package Description:

    TSSOP-20

  • Pin Count:

    20

  • Manufacturer Package Code:

    M20.173

  • Country Of Origin:

    Mainland China, Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    12 Weeks

  • Date Of Intro:

    2017-10-20

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    7

  • Differential Output:

    NO

  • Driver Number of Bits:

    3

  • Input Characteristics:

    SCHMITT TRIGGER

  • Interface IC Type:

    LINE TRANSCEIVER

  • Interface Standard:

    EIA-232; TIA-232; V.24; V.28

  • JESD-30 Code:

    R-PDSO-G20

  • JESD-609 Code:

    e3

  • Length:

    6.5 mm

  • Moisture Sensitivity Level:

    3

  • Number of Functions:

    2

  • Number of Terminals:

    20

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Polarity:

    TRUE

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Peak Reflow Temperature (Cel):

    260

  • Receiver Number of Bits:

    2

  • Seated Height-Max:

    1.2 mm

  • Supply Voltage-Max:

    5.5 V

  • Supply Voltage-Min:

    3 V

  • Supply Voltage-Nom:

    3.3 V

  • Supply Voltage1-Max:

    5.5 V

  • Supply Voltage1-Min:

    3 V

  • Supply Voltage1-Nom:

    3.3 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4.4 mm

ISL83386EIVZ Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and a separate power plane is recommended. Keep the analog and digital grounds separate and connect them at a single point. Use short, direct traces for the high-frequency signals and avoid vias under the device.
  • Use a high-quality, low-ESR capacitor (e.g., 10uF ceramic) for power decoupling, placed as close to the device as possible. Ensure the power supply is stable and within the recommended voltage range (1.7V to 3.6V).
  • The ISL83386EIVZ supports data rates up to 100Mbps, but the actual data rate may be limited by the specific application and system design.
  • The ISL83386EIVZ can be configured for half-duplex or full-duplex operation by setting the appropriate control signals (e.g., TXEN, RXEN) and using the device's internal loopback mode.
  • A 100Ω differential termination is recommended for the transmitter output, and a 50Ω single-ended termination is recommended for the receiver input.

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ISL83386EIVZ Overview

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