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ISL85033IRTZ-T - Renesas Electronics

Description: The ISL85033 is a dual standard buck regulator capable of 3A per channel continuous output current. With an input range of 4. 5V to 28V, it provides a high frequency power solution for a variety of point of load applications. The PWM controller in the ISL85033 drives an internal switching N-Channel power MOSFET and requires an external Schottky diode to generate the output voltage. The integrated power switch is optimized for excellent thermal performance up to 3A of output current. The PWM regulator switch

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ISL85033IRTZ-T - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L28.4x4 TQFN
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ISL85033IRTZ-T - Renesas Electronics  - 3D model - Quad Flat No-Lead - L28.4x4 TQFN
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ISL85033IRTZ-T Details

  • Manufacturer Part Number:

    ISL85033IRTZ-T

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    TQFN

  • Package Description:

    TQFN-28

  • Pin Count:

    28

  • Manufacturer Package Code:

    L28.4X4

  • Country Of Origin:

    Malaysia

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Factory Lead Time:

    18 Weeks

  • Date Of Intro:

    2017-10-23

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • Additional Feature:

    ADJUSTABLE UPTO 3AMP

  • Analog IC - Other Type:

    SWITCHING REGULATOR

  • Control Mode:

    CURRENT-MODE

  • Control Technique:

    PULSE WIDTH MODULATION

  • Input Voltage-Max:

    28 V

  • Input Voltage-Min:

    4.5 V

  • Input Voltage-Nom:

    12 V

  • JESD-30 Code:

    S-PQCC-N28

  • Length:

    4 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    28

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Current-Max:

    3 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC28,.16SQ,16

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Seated Height-Max:

    0.8 mm

  • Surface Mount:

    YES

  • Switcher Configuration:

    BUCK

  • Switching Frequency-Max:

    2000 kHz

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Pure Matte Tin (Sn) - annealed

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.4 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    4 mm

ISL85033IRTZ-T Frequently Asked Questions (FAQs)

  • A good PCB layout for optimal thermal performance involves placing the device near a thermal pad or a heat sink, and ensuring good thermal conductivity between the device and the heat sink. The datasheet provides some guidelines, but a more detailed application note from Renesas provides additional recommendations.
  • To ensure reliable start-up and shutdown, it's essential to follow the recommended power-up and power-down sequences outlined in the datasheet. Additionally, ensure that the input voltage rises and falls monotonically, and that the input capacitance is within the recommended range.
  • Operating the device outside the recommended operating conditions can lead to reduced performance, decreased reliability, and potentially even damage to the device. It's essential to ensure that the device operates within the specified temperature range, input voltage range, and output current range to guarantee optimal performance and reliability.
  • To troubleshoot issues with the device, start by verifying that the input voltage and output current are within the recommended ranges. Check for any signs of overheating, and ensure that the PCB layout is optimal for thermal performance. If the issue persists, consult the datasheet and application notes for troubleshooting guidelines, or contact Renesas support for further assistance.
  • The ISL85033IRTZ-T is designed to meet CISPR 22 Class B EMI standards. To ensure EMI compliance, follow the recommended PCB layout and component placement guidelines, and use proper shielding and filtering techniques. Additionally, ensure that the device is operated within the recommended frequency range to minimize EMI emissions.

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ISL85033IRTZ-T Overview

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