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IXDF602SITR - LITTELFUSE

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IXDF602SITR - LITTELFUSE  - 3D model
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IXDF602SITR Details

  • Manufacturer Part Number:

    IXDF602SITR

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • Length:

    4.9 mm

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    2 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HSOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE, HEAT SINK/SLUG

  • Peak Reflow Temperature (Cel):

    NOT SPECIFIED

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    NOT SPECIFIED

  • Turn-off Time:

    0.038 µs

  • Turn-on Time:

    0.04 µs

  • Width:

    3.9 mm

IXDF602SITR Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXDF602SITR is a standard SOT-223 package with a minimum pad size of 1.5mm x 1.5mm and a thermal pad size of 2.5mm x 2.5mm.
  • To ensure reliable operation of IXDF602SITR in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using thermal interface materials, and keeping the device within its specified operating temperature range.
  • Yes, IXDF602SITR is suitable for high-frequency switching applications up to 1MHz. However, it is recommended to consult the datasheet and application notes for specific guidance on layout, component selection, and thermal management.
  • To protect IXDF602SITR from EOS and ESD, it is recommended to follow proper handling and storage procedures, use ESD protection devices, and implement circuit protection measures such as TVS diodes and resistors.
  • Yes, IXDF602SITR is compatible with lead-free soldering processes and meets the requirements of the RoHS directive.

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IXDF602SITR Overview

Use the download button to access the IXDF602SITR 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
To find more CAD model downloads similar to this part, try a partial part number search, like IXDF6, or try a keyword search, such as MOSFET Drivers

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