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IXDI609SIA - LITTELFUSE

Description: Gate Drivers 9-Ampere Low-Side Ultrafast MOSFET

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PCB Footprints
IXDI609SIA - LITTELFUSE PCB footprint - Other - Other - 8-Pin SOIC (N-PACKAGE)
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3D Models
IXDI609SIA - LITTELFUSE  - 3D model - Other - 8-Pin SOIC (N-PACKAGE)
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IXDI609SIA Details

  • Manufacturer Part Number:

    IXDI609SIA

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.39.00.60

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    8.1

  • High Side Driver:

    NO

  • Interface IC Type:

    BUFFER OR INVERTER BASED IGBT/MOSFET DRIVER

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    4.9 mm

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    1

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Peak Current Limit-Nom:

    9 A

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Supply Voltage-Max:

    35 V

  • Supply Voltage-Min:

    4.5 V

  • Supply Voltage-Nom:

    18 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    MATTE TIN

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Turn-off Time:

    0.04 µs

  • Turn-on Time:

    0.055 µs

  • Width:

    3.9 mm

IXDI609SIA Frequently Asked Questions (FAQs)

  • Littelfuse recommends a PCB layout with a thermal pad connected to a large copper area on the PCB to dissipate heat efficiently. A minimum of 1 oz copper is recommended.
  • Yes, the IXDI609SIA is designed for high-reliability applications. It is qualified to AEC-Q101 standards and has a high mean time between failures (MTBF) rating.
  • Littelfuse recommends following the recommended soldering profile and using a solder with a melting point above 217°C (423°F). Additionally, ensure the PCB is clean and free of oxidation before soldering.
  • The IXDI609SIA can withstand a maximum voltage stress of 1.5 times the rated voltage during power-up or power-down, but this should be limited to a duration of less than 100 ms.
  • Yes, the IXDI609SIA is rated for use in high-temperature environments up to 150°C (302°F). However, the device's performance and reliability may degrade at higher temperatures.

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IXDI609SIA Overview

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