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- Datasheet Download Datasheet
- Stock & Prices $ Price & Stock for IXFH30N50P
- Part Number IXFH30N50P
- Manufacturer LITTELFUSE
- Last Modified Date Aug 2, 2021 10:22 PM UTC
- Pinout / Pin List Click Here (Member Only)
IXFH30N50P Details
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Manufacturer Part Number:
IXFH30N50P
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Rohs Code:
Yes
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Part Life Cycle Code:
Active
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Country Of Origin:
Philippines
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ECCN Code:
EAR99
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Manufacturer:
Littelfuse Inc
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YTEOL:
6
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Additional Feature:
AVALANCHE RATED
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Avalanche Energy Rating (Eas):
1200 mJ
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Case Connection:
DRAIN
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Configuration:
SINGLE WITH BUILT-IN DIODE
IXFH30N50P Frequently Asked Questions (FAQs)
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The recommended PCB footprint for the IXFH30N50P is a pad layout with a minimum size of 2.5mm x 2.5mm, with a 1.5mm x 1.5mm thermal pad in the center. This ensures proper heat dissipation and electrical connection.
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While the IXFH30N50P has a maximum junction temperature rating of 150°C, it's recommended to derate the device's power handling capability at high temperatures. Consult the datasheet's thermal derating curve to determine the maximum power handling at your specific operating temperature.
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To ensure proper soldering, use a soldering iron with a temperature of 250°C to 260°C, and apply a small amount of solder paste to the PCB pads. Use a soldering technique that minimizes the thermal stress on the device, such as reflow soldering or hand soldering with a low-temperature solder.
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Littelfuse recommends using a wire bonding method that minimizes the stress on the device's bond wires. A ball-wedge or wedge-wedge bonding method is recommended, with a bond wire diameter of 0.5mm to 1.0mm and a bond force of 10gf to 20gf.
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Yes, the IXFH30N50P is suitable for high-reliability and automotive applications. It meets the requirements of AEC-Q101, a standard for automotive-grade semiconductor devices. However, it's essential to consult the datasheet and application notes to ensure the device meets your specific application requirements.
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IXFH30N50P Overview
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