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IXGH30N60C3D1 - LITTELFUSE

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IXGH30N60C3D1 - LITTELFUSE  - 3D model
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IXGH30N60C3D1 Details

  • Manufacturer Part Number:

    IXGH30N60C3D1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    60 A

  • Collector-Emitter Voltage-Max:

    600 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    5.5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    220 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    160 ns

  • Turn-on Time-Nom (ton):

    45 ns

  • VCEsat-Max:

    3 V

IXGH30N60C3D1 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXGH30N60C3D1 is a TO-247-3L package with a minimum pad size of 6.5mm x 4.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • To ensure reliable soldering, use a soldering iron with a temperature range of 250°C to 260°C, and apply a solder flux to the pins. Avoid applying excessive force or pressure to the device during soldering.
  • The maximum allowed junction temperature for the IXGH30N60C3D1 is 150°C. Operating the device above this temperature can reduce its lifespan and affect its performance.
  • Yes, the IXGH30N60C3D1 is suitable for high-frequency switching applications up to 100 kHz. However, it's essential to consider the device's switching losses, gate drive requirements, and thermal management when designing the application.
  • To protect the IXGH30N60C3D1 from ESD, handle the device with an anti-static wrist strap or mat, and ensure that the PCB and assembly process are ESD-compliant. Avoid touching the device's pins or exposed metal surfaces.

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IXGH30N60C3D1 Overview

Use the download button to access the IXGH30N60C3D1 3D model. You can still request or build the schematic symbol and PCB footprint by using the respective build or request forms on this page.
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