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IXTH11P50 - LITTELFUSE

Description: MOSFET -11 Amps -500V 0.75 Rds

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PCB Footprints
IXTH11P50 - LITTELFUSE PCB footprint - Transistor Outline, Vertical - Transistor Outline, Vertical - TO-247 (IXTH) Outline
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3D Models
IXTH11P50 - LITTELFUSE  - 3D model - Transistor Outline, Vertical - TO-247 (IXTH) Outline
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IXTH11P50 Details

  • Manufacturer Part Number:

    IXTH11P50

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    6

  • Additional Feature:

    AVALANCHE RATED

  • Avalanche Energy Rating (Eas):

    1000 mJ

  • Case Connection:

    DRAIN

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DS Breakdown Voltage-Min:

    500 V

  • Drain Current-Max (ID):

    11 A

  • Drain-source On Resistance-Max:

    0.75 Ω

  • FET Technology:

    METAL-OXIDE SEMICONDUCTOR

  • Feedback Cap-Max (Crss):

    187 pF

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Mode:

    ENHANCEMENT MODE

  • Operating Temperature-Max:

    150 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    P-CHANNEL

  • Power Dissipation-Max (Abs):

    300 W

  • Pulsed Drain Current-Max (IDM):

    44 A

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Element Material:

    SILICON

IXTH11P50 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for the IXTH11P50 is a standard SOT-223 package with a minimum pad size of 2.5mm x 2.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • To ensure reliable operation of the IXTH11P50 in high-temperature environments, it is recommended to follow proper thermal management practices, such as providing adequate heat sinking, using a thermally conductive PCB material, and ensuring good airflow around the device.
  • The maximum allowed voltage transient for the IXTH11P50 is 100V for a duration of 100ms, as specified in the datasheet. However, it is recommended to follow the voltage rating of the device and avoid voltage transients that exceed the maximum rated voltage.
  • The IXTH11P50 is designed for low-frequency applications up to 100kHz. While it may be possible to use it in high-frequency applications, the device's performance and reliability may be affected. It is recommended to consult with Littelfuse Inc or a qualified engineer for high-frequency application guidance.
  • The recommended storage temperature range for the IXTH11P50 is -40°C to 125°C, as specified in the datasheet. It is recommended to store the devices in a dry, cool place, away from direct sunlight and moisture.

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IXTH11P50 Overview

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Part Image IXTH11P50 IXYS Corporation

Power Field-Effect Transistor, 11A I(D), 500V, 0.75ohm, 1-Element, P-Channel, Silicon, Metal-oxide Semiconductor FET, TO-247AD