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IXXH50N60C3D1 - LITTELFUSE

Description: Trans IGBT Chip N-CH 600V 100A 600W 3-Pin(3+Tab) TO-247AD

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IXXH50N60C3D1 - LITTELFUSE  - 3D model
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IXXH50N60C3D1 Details

  • Manufacturer Part Number:

    IXXH50N60C3D1

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Country Of Origin:

    Philippines

  • ECCN Code:

    EAR99

  • Manufacturer:

    Littelfuse Inc

  • YTEOL:

    5

  • Case Connection:

    COLLECTOR

  • Collector Current-Max (IC):

    100 A

  • Collector-Emitter Voltage-Max:

    600 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • Gate-Emitter Thr Voltage-Max:

    5.5 V

  • Gate-Emitter Voltage-Max:

    20 V

  • JEDEC-95 Code:

    TO-247AD

  • JESD-30 Code:

    R-PSFM-T3

  • JESD-609 Code:

    e3

  • Number of Elements:

    1

  • Number of Terminals:

    3

  • Operating Temperature-Max:

    175 °C

  • Operating Temperature-Min:

    -55 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    FLANGE MOUNT

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    N-CHANNEL

  • Power Dissipation-Max (Abs):

    600 W

  • Surface Mount:

    NO

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    THROUGH-HOLE

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    10

  • Transistor Application:

    POWER CONTROL

  • Transistor Element Material:

    SILICON

  • Turn-off Time-Nom (toff):

    170 ns

  • Turn-on Time-Nom (ton):

    69 ns

  • VCEsat-Max:

    2.3 V

IXXH50N60C3D1 Frequently Asked Questions (FAQs)

  • The recommended PCB footprint for IXXH50N60C3D1 is a TO-247 package with a minimum pad size of 5.5mm x 4.5mm and a thermal pad size of 3.5mm x 3.5mm.
  • Yes, IXXH50N60C3D1 is a high-reliability device that meets the requirements of AEC-Q101, making it suitable for use in automotive and other high-reliability applications.
  • To ensure proper soldering, follow the recommended soldering profile of 260°C for 10 seconds, and use a solder with a melting point of 217°C to 221°C. Also, ensure the PCB is clean and free of oxidation.
  • The maximum allowed junction temperature for IXXH50N60C3D1 is 175°C, and it is recommended to keep the junction temperature below 150°C for optimal performance and reliability.
  • Yes, IXXH50N60C3D1 can be used in a parallel configuration, but it is essential to ensure that the devices are properly matched and that the gate drive circuitry is designed to handle the increased current.

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IXXH50N60C3D1 Overview

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