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KAD5612P-21Q72 - Renesas Electronics

Description: The KAD5612P is a family of low-power, high-performance, dual-channel 12-bit, analog-to-digital converters. Designed with FemtoCharge™ technology on a standard CMOS process, the family supports sampling rates of up to 250MSPS. The KAD5612P-25 is the fastest member of this pin-compatible family, which also features sample rates of 210MSPS (KAD5612P-21), 170MSPS (KAD5612P-17) and 125MSPS (KAD5612P-12). A Serial Peripheral Interface (SPI) port allows for extensive configurability, as well as fine control of ga

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KAD5612P-21Q72 - Renesas Electronics PCB footprint - Quad Flat No-Lead - Quad Flat No-Lead - L72.10x10D
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KAD5612P-21Q72 - Renesas Electronics  - 3D model - Quad Flat No-Lead - L72.10x10D
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KAD5612P-21Q72 Details

  • Manufacturer Part Number:

    KAD5612P-21Q72

  • Brand Name:

    Renesas

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    QFN

  • Package Description:

    QFN-72

  • Pin Count:

    72

  • Manufacturer Package Code:

    L72.10X10D

  • Country Of Origin:

    Canada, Malaysia

  • ECCN Code:

    3A991.C.2

  • HTS Code:

    8542.39.00.30

  • Factory Lead Time:

    18 Weeks

  • Manufacturer:

    Renesas Electronics Corporation

  • YTEOL:

    8

  • Analog Input Voltage-Max:

    1.54 V

  • Analog Input Voltage-Min:

    -1.54 V

  • Conversion Time-Max:

    0.00476 µs

  • Converter Type:

    ADC, SUCCESSIVE APPROXIMATION

  • JESD-30 Code:

    S-PQCC-N72

  • JESD-609 Code:

    e4

  • Length:

    10 mm

  • Linearity Error-Max (EL):

    0.048828%

  • Moisture Sensitivity Level:

    3

  • Number of Analog In Channels:

    2

  • Number of Bits:

    12

  • Number of Functions:

    1

  • Number of Terminals:

    72

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Output Bit Code:

    OFFSET BINARY, 2'S COMPLEMENT BINARY, GRAY CODE

  • Output Format:

    PARALLEL, WORD

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    HVQCCN

  • Package Equivalence Code:

    LCC72,.39SQ,20

  • Package Shape:

    SQUARE

  • Package Style:

    CHIP CARRIER, HEAT SINK/SLUG, VERY THIN PROFILE

  • Peak Reflow Temperature (Cel):

    260

  • Sample Rate:

    210 MHz

  • Sample and Hold / Track and Hold:

    SAMPLE

  • Seated Height-Max:

    0.9 mm

  • Supply Voltage-Nom:

    1.8 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    Nickel/Palladium/Gold (Ni/Pd/Au)

  • Terminal Form:

    NO LEAD

  • Terminal Pitch:

    0.5 mm

  • Terminal Position:

    QUAD

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Width:

    10 mm

KAD5612P-21Q72 Frequently Asked Questions (FAQs)

  • A 4-layer PCB with a solid ground plane and thermal vias is recommended. The device should be placed near a thermal pad or heat sink to dissipate heat efficiently.
  • Ensure that the device is operated within the recommended voltage and current ranges, and that the PCB is designed to minimize thermal gradients. Also, consider using thermal simulation tools to optimize the design.
  • Critical timing parameters include clock frequency, setup and hold times, and propagation delay. Ensure that these parameters are met by carefully designing the clock tree, using clock domain crossing (CDC) techniques, and verifying timing closure using static timing analysis (STA) tools.
  • Power sequencing should be handled by ensuring that the power supplies are turned on in the correct order, and that the POR signal is asserted correctly. Use a power management IC (PMIC) or a dedicated power sequencing circuit to ensure reliable power-up and power-down sequences.
  • Use ESD protection devices such as TVS diodes or ESD arrays on the I/O lines, and ensure that the PCB design includes adequate spacing and creepage distances to prevent latch-up. Also, consider using a latch-up prevention circuit or a dedicated ESD protection IC.

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KAD5612P-21Q72 Overview

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