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KSC5502DTM - onsemi

Description: High Voltage Power Switch Switching; Small Variance in Storage Time; Built-in Free-Wheeling Diode; Wide Safe Operating Area; Two Package Choices: D-PAK or TO-220; Suitable for Electronic Ballast

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KSC5502DTM - onsemi PCB footprint - Other - Other - KSC5502DTM-1
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KSC5502DTM - onsemi  - 3D model - Other - KSC5502DTM-1
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KSC5502DTM Details

  • Manufacturer Part Number:

    KSC5502DTM

  • Brand Name:

    onsemi

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    DPAK-3 / TO-252-3

  • Package Description:

    DPAK-3

  • Manufacturer Package Code:

    369AS

  • Country Of Origin:

    Mainland China

  • ECCN Code:

    EAR99

  • Factory Lead Time:

    10 Weeks

  • Manufacturer:

    onsemi

  • YTEOL:

    4

  • Collector Current-Max (IC):

    2 A

  • Collector-Emitter Voltage-Max:

    600 V

  • Configuration:

    SINGLE WITH BUILT-IN DIODE

  • DC Current Gain-Min (hFE):

    4

  • JEDEC-95 Code:

    TO-252

  • JESD-30 Code:

    R-PSSO-G2

  • JESD-609 Code:

    e3

  • Moisture Sensitivity Level:

    1

  • Number of Elements:

    1

  • Number of Terminals:

    2

  • Operating Temperature-Max:

    150 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Peak Reflow Temperature (Cel):

    260

  • Polarity/Channel Type:

    NPN

  • Power Dissipation-Max (Abs):

    50 W

  • Qualification Status:

    Not Qualified

  • Surface Mount:

    YES

  • Terminal Finish:

    Matte Tin (Sn) - annealed

  • Terminal Form:

    GULL WING

  • Terminal Position:

    SINGLE

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Transistor Application:

    SWITCHING

  • Transistor Element Material:

    SILICON

  • Transition Frequency-Nom (fT):

    11 MHz

KSC5502DTM Frequently Asked Questions (FAQs)

  • A 2-layer or 4-layer PCB with a solid ground plane and thermal vias is recommended. Keep the thermal pad connected to the ground plane to improve heat dissipation.
  • Monitor the device's junction temperature, voltage, and current to ensure they are within the specified limits. Use a thermal management system and follow the recommended PCB layout to minimize thermal resistance.
  • A non-inverting gate drive circuit with a gate resistor (Rg) between 10Ω to 100Ω and a gate-source voltage (Vgs) of 10V to 15V is recommended. This ensures proper switching and minimizes electromagnetic interference (EMI).
  • Handle the device by the body or use an anti-static wrist strap. Use ESD-protected workstations and follow proper ESD handling procedures to prevent damage.
  • Store the device in a dry, cool place (below 25°C and 60% relative humidity) in its original packaging or an anti-static bag to prevent moisture and ESD damage.

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KSC5502DTM Overview

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Part Image KSC5502DT Fairchild Semiconductor Corporation

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Part Image KSC5502DJ69Z Fairchild Semiconductor Corporation

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