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LMC6035IM - Texas Instruments

Description: OpAmpIC

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LMC6035IM - Texas Instruments PCB footprint - Other - Other - SOIC127P600X175-8N
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LMC6035IM - Texas Instruments  - 3D model - Other - SOIC127P600X175-8N
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LMC6035IM Details

  • Manufacturer Part Number:

    LMC6035IM

  • Pbfree Code:

    No

  • Part Life Cycle Code:

    Obsolete

  • Part Package Code:

    SOIC

  • Package Description:

    0.150 INCH, SO-8

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    0

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.00009 µA

  • Common-mode Reject Ratio-Min:

    60 dB

  • Common-mode Reject Ratio-Nom:

    96 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    5000 µV

  • JESD-30 Code:

    R-PDSO-G8

  • JESD-609 Code:

    e0

  • Length:

    4.9 mm

  • Low-Bias:

    YES

  • Low-Offset:

    NO

  • Micropower:

    YES

  • Moisture Sensitivity Level:

    1

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    85 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    SOP

  • Package Equivalence Code:

    SOP8,.25

  • Package Shape:

    RECTANGULAR

  • Package Style:

    SMALL OUTLINE

  • Packing Method:

    RAIL

  • Peak Reflow Temperature (Cel):

    235

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.75 mm

  • Slew Rate-Nom:

    1.5 V/us

  • Supply Current-Max:

    1.9 mA

  • Supply Voltage Limit-Max:

    16 V

  • Supply Voltage-Nom (Vsup):

    2.7 V

  • Surface Mount:

    YES

  • Technology:

    CMOS

  • Temperature Grade:

    INDUSTRIAL

  • Terminal Finish:

    TIN LEAD

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    1.27 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    20

  • Unity Gain BW-Nom:

    1400

  • Voltage Gain-Min:

    20000

  • Wideband:

    NO

  • Width:

    3.905 mm

LMC6035IM Frequently Asked Questions (FAQs)

  • To minimize noise and ensure stability, it is recommended to follow a star-grounding layout, keep the input and output traces short and away from each other, and use a solid ground plane. Additionally, decouple the power supply pins with 0.1uF and 10uF capacitors, and use a low-ESR capacitor for the compensation capacitor (Ccomp).
  • The compensation capacitor (Ccomp) value depends on the gain and bandwidth requirements of your application. A general rule of thumb is to start with a value of 10pF to 22pF and adjust based on the desired closed-loop bandwidth. A higher value of Ccomp will reduce the bandwidth but improve stability, while a lower value will increase the bandwidth but may lead to instability.
  • The LMC6035IM can drive a maximum capacitive load of 100pF to 200pF, depending on the output voltage swing and frequency. Exceeding this limit may lead to oscillations or instability. If a higher capacitive load is required, consider adding a series resistor or using a buffer stage.
  • To ensure that the LMC6035IM is operating within its safe operating area (SOA), verify that the output current does not exceed 30mA, the input voltage does not exceed the supply voltage, and the junction temperature does not exceed 150°C. Also, ensure that the device is not exposed to excessive voltage transients or ESD events.
  • To prevent latch-up or damage, it is recommended to power up the LMC6035IM in the following sequence: VCC, then VIN, and then any external voltage references. When powering down, reverse this sequence. Additionally, ensure that the input signals are within the specified voltage range during power-up and power-down.

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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