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LMP7702MMX/NOPB - Texas Instruments

Description: Precision, CMOS Input, RRIO, Wide Supply Range Dual Amplifier

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LMP7702MMX/NOPB - Texas Instruments PCB footprint - Small Outline Packages - Small Outline Packages - DGK  (S-PDSO-G8)
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LMP7702MMX/NOPB - Texas Instruments  - 3D model - Small Outline Packages - DGK  (S-PDSO-G8)
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LMP7702MMX/NOPB Details

  • Manufacturer Part Number:

    LMP7702MMX/NOPB

  • Brand Name:

    Texas Instruments

  • Pbfree Code:

    Yes

  • Rohs Code:

    Yes

  • Part Life Cycle Code:

    Active

  • Part Package Code:

    SOIC

  • Pin Count:

    8

  • ECCN Code:

    EAR99

  • HTS Code:

    8542.33.00.01

  • Manufacturer:

    Texas Instruments

  • YTEOL:

    15

  • Amplifier Type:

    OPERATIONAL AMPLIFIER

  • Architecture:

    VOLTAGE-FEEDBACK

  • Average Bias Current-Max (IIB):

    0.0004 µA

  • Bias Current-Max (IIB) @25C:

    0.000001 µA

  • Common-mode Reject Ratio-Min:

    92 dB

  • Common-mode Reject Ratio-Nom:

    138 dB

  • Frequency Compensation:

    YES

  • Input Offset Voltage-Max:

    220 µV

  • JESD-30 Code:

    S-PDSO-G8

  • JESD-609 Code:

    e3

  • Length:

    3 mm

  • Low-Bias:

    YES

  • Low-Offset:

    YES

  • Micropower:

    NO

  • Moisture Sensitivity Level:

    1

  • Neg Supply Voltage Limit-Max:

    -6.6 V

  • Neg Supply Voltage-Nom (Vsup):

    -5 V

  • Number of Functions:

    2

  • Number of Terminals:

    8

  • Operating Temperature-Max:

    125 °C

  • Operating Temperature-Min:

    -40 °C

  • Package Body Material:

    PLASTIC/EPOXY

  • Package Code:

    TSSOP

  • Package Equivalence Code:

    TSSOP8,.19

  • Package Shape:

    SQUARE

  • Package Style:

    SMALL OUTLINE, THIN PROFILE, SHRINK PITCH

  • Packing Method:

    TR

  • Peak Reflow Temperature (Cel):

    260

  • Power:

    NO

  • Programmable Power:

    NO

  • Qualification Status:

    Not Qualified

  • Seated Height-Max:

    1.1 mm

  • Slew Rate-Nom:

    1 V/us

  • Subcategory:

    Operational Amplifier

  • Supply Current-Max:

    2.1 mA

  • Supply Voltage Limit-Max:

    6.6 V

  • Supply Voltage-Nom (Vsup):

    5 V

  • Surface Mount:

    YES

  • Technology:

    BIPOLAR

  • Temperature Grade:

    AUTOMOTIVE

  • Terminal Finish:

    Matte Tin (Sn)

  • Terminal Form:

    GULL WING

  • Terminal Pitch:

    0.65 mm

  • Terminal Position:

    DUAL

  • Time@Peak Reflow Temperature-Max (s):

    30

  • Unity Gain BW-Nom:

    2500

  • Voltage Gain-Min:

    50100

  • Wideband:

    NO

  • Width:

    3 mm

LMP7702MMX/NOPB Frequently Asked Questions (FAQs)

  • A good PCB layout for the LMP7702 involves keeping the input and output traces short and separate, using a solid ground plane, and placing the device close to the analog signal sources. Additionally, it's recommended to use a 4-layer PCB with a dedicated analog ground plane to minimize noise and interference.
  • To ensure the LMP7702 operates within its recommended operating conditions, verify that the input voltage is within the specified range (2.7V to 5.5V), the operating temperature is within the specified range (-40°C to 125°C), and the device is not exposed to excessive noise or electromagnetic interference.
  • The recommended capacitor value for the BYPASS pin is 10nF to 100nF, depending on the specific application and noise requirements. A larger capacitor value can help reduce noise, but may also increase the startup time of the device.
  • To minimize power consumption in battery-powered applications, consider using a lower supply voltage, reducing the operating frequency, and using the device's shutdown mode when not in use. Additionally, optimizing the PCB layout and reducing the number of active circuits can also help minimize power consumption.
  • The recommended input impedance for the LMP7702 is greater than 1kΩ to ensure proper operation and minimize input bias current. A higher input impedance can help reduce input bias current and improve overall performance.

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LMP7702MMX/NOPB Overview

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About Texas Instruments

Texas Instruments (TI) designs and manufactures semiconductors and integrated circuits for a wide range of applications. The company's product portfolio includes analog chips, which are essential for managing power and signal functions in electronic devices, and embedded processors, which serve as the brains in various systems, enabling functionality in everything from industrial equipment to consumer electronics. TI's innovations in semiconductor technology have made it a leader in the industry.

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